Device attachment with infrared imaging sensor

ABSTRACT

Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.14/281,883 filed May 19, 2014 and entitled “DEVICE ATTACHMENT WITHINFRARED IMAGING SENSOR,” and a continuation-in-part of U.S. patentapplication Ser. No. 14/747,202 filed Jun. 23, 2015 and entitled “DEVICEATTACHMENT WITH INFRARED IMAGING SENSOR,” both of which are herebyincorporated by reference in their entirety.

U.S. patent application Ser. No. 14/281,883 is a continuation-in-part ofU.S. patent application Ser. No. 11/841,036 filed Aug. 20, 2007 issuedas U.S. Pat. No. 8,727,608 on May 20, 2014 and entitled “MOISTURE METERWITH NON-CONTACT INFRARED THERMOMETER,” which is hereby incorporated byreference in its entirety.

U.S. patent application Ser. No. 11/841,036 is a continuation-in-part ofU.S. patent application Ser. No. 11/189,122 filed Jul. 25, 2005 issuedas U.S. Pat. No. 7,452,127 on Nov. 18, 2008 and entitled “ANEMOMETERWITH NON-CONTACT TEMPERATURE MEASUREMENT,” which is hereby incorporatedby reference in its entirety.

U.S. patent application Ser. No. 11/841,036 is also acontinuation-in-part of U.S. patent application Ser. No. 11/039,653filed Jan. 19, 2005 issued as U.S. Pat. No. 7,168,316 on Jan. 30, 2007and entitled “HUMIDITY METER WITH NON-CONTACT TEMPERATURE MEASUREMENT,”which is hereby incorporated by reference in its entirety.

U.S. patent application Ser. No. 11/841,036 is also acontinuation-in-part of U.S. patent application Ser. No. 10/910,894filed Aug. 4, 2004 issued as U.S. Pat. No. 7,163,336 on Jan. 16, 2007and entitled “INSTRUMENT FOR NON-CONTACT INFRARED TEMPERATUREMEASUREMENT HAVING CURRENT CLAMP METER FUNCTIONS,” which is herebyincorporated by reference in its entirety.

U.S. patent application Ser. No. 11/841,036 is also acontinuation-in-part of U.S. patent application Ser. No. 10/911,177filed Aug. 4, 2004 issued as U.S. Pat. No. 7,111,981 on Sep. 26, 2006and entitled “INSTRUMENT FOR NON-CONTACT INFRARED TEMPERATUREMEASUREMENT COMBINED WITH TACHOMETER FUNCTIONS,” which is herebyincorporated by reference in its entirety.

U.S. patent application Ser. No. 11/841,036 is also acontinuation-in-part of U.S. patent application Ser. No. 10/654,851filed Sep. 4, 2003 issued as U.S. Pat. No. 7,056,012 on Jun. 6, 2006 andentitled “MULTIMETER WITH NON-CONTACT TEMPERATURE MEASUREMENT,” which ishereby incorporated by reference in its entirety.

U.S. patent application Ser. No. 14/281,883 claims the benefit of U.S.Provisional Patent Application No. 61/938,388 filed Feb. 11, 2014 andentitled “MEASUREMENT DEVICE WITH THERMAL IMAGING CAPABILITIES ANDRELATED METHODS,” which is hereby incorporated by reference in itsentirety.

U.S. patent application Ser. No. 14/281,883 is also acontinuation-in-part of U.S. patent application Ser. No. 14/034,493filed Sep. 23, 2013 and entitled “MEASUREMENT DEVICE FOR ELECTRICALINSTALLATIONS AND RELATED METHODS,” which is hereby incorporated byreference in its entirety.

U.S. patent application Ser. No. 14/034,493 is a continuation-in-part ofInternational Patent Application No. PCT/US13/059831 filed Sep. 13, 2013and entitled “MEASUREMENT DEVICE FOR ELECTRICAL INSTALLATIONS ANDRELATED METHODS,” which is hereby incorporated by reference in itsentirety.

International Patent Application No. PCT/US13/059831 claims the benefitof U.S. Provisional Patent Application No. 61/701,292 filed Sep. 14,2012 and entitled “MEASUREMENT DEVICE FOR ELECTRICAL INSTALLATIONS ANDRELATED METHODS,” which is hereby incorporated by reference in itsentirety.

International Patent Application No. PCT/US13/059831 also claims thebenefit of U.S. Provisional Patent Application No. 61/748,018 filed Dec.31, 2012 and entitled “COMPACT MULTI-SPECTRUM IMAGING WITH FUSION,”which is hereby incorporated by reference in its entirety.

U.S. patent application Ser. No. 14/281,883 is also acontinuation-in-part of International Patent Application No.PCT/US2013/062433 filed Sep. 27, 2013 and entitled “DEVICE ATTACHMENTWITH INFRARED IMAGING SENSOR,” which is hereby incorporated by referencein its entirety.

International Patent Application No. PCT/US2013/062433 claims thebenefit of U.S. Provisional Patent Application No. 61/880,827 filed Sep.20, 2013 and entitled “DEVICE ATTACHMENT WITH INFRARED IMAGING SENSOR,”which is hereby incorporated by reference in its entirety.

International Patent Application No. PCT/US2013/062433 is acontinuation-in-part of U.S. patent application Ser. No. 13/901,428filed May 23, 2013 and entitled “DEVICE ATTACHMENT WITH INFRARED IMAGINGSENSOR,” which is hereby incorporated by reference in its entirety.

U.S. patent application Ser. No. 14/281,883 is also acontinuation-in-part of U.S. patent application Ser. No. 14/101,245filed Dec. 9, 2013 and entitled “LOW POWER AND SMALL FORM FACTORINFRARED IMAGING” which is hereby incorporated by reference in itsentirety.

U.S. patent application Ser. No. 14/101,245 is a continuation ofInternational Patent Application No. PCT/US2012/041744 filed Jun. 8,2012 and entitled “LOW POWER AND SMALL FORM FACTOR INFRARED IMAGING”which is hereby incorporated by reference in its entirety.

International Patent Application No. PCT/US2012/041744 claims thebenefit of U.S. Provisional Patent Application No. 61/656,889 filed Jun.7, 2012 and entitled “LOW POWER AND SMALL FORM FACTOR INFRARED IMAGING”which is hereby incorporated by reference in its entirety.

International Patent Application No. PCT/US2012/041744 claims thebenefit of U.S. Provisional Patent Application No. 61/545,056 filed Oct.7, 2011 and entitled “NON-UNIFORMITY CORRECTION TECHNIQUES FOR INFRAREDIMAGING DEVICES” which is hereby incorporated by reference in itsentirety.

International Patent Application No. PCT/US2012/041744 claims thebenefit of U.S. Provisional Patent Application No. 61/495,873 filed Jun.10, 2011 and entitled “INFRARED CAMERA PACKAGING SYSTEMS AND METHODS”which is hereby incorporated by reference in its entirety.

International Patent Application No. PCT/US2012/041744 claims thebenefit of U.S. Provisional Patent Application No. 61/495,879 filed Jun.10, 2011 and entitled “INFRARED CAMERA SYSTEM ARCHITECTURES” which ishereby incorporated by reference in its entirety.

International Patent Application No. PCT/US2012/041744 claims thebenefit of U.S. Provisional Patent Application No. 61/495,888 filed Jun.10, 2011 and entitled “INFRARED CAMERA CALIBRATION TECHNIQUES” which ishereby incorporated by reference in its entirety.

U.S. patent application Ser. No. 14/281,883 is also acontinuation-in-part of U.S. patent application Ser. No. 14/099,818filed Dec. 6, 2013 and entitled “NON-UNIFORMITY CORRECTION TECHNIQUESFOR INFRARED IMAGING DEVICES” which is hereby incorporated by referencein its entirety.

U.S. patent application Ser. No. 14/099,818 is a continuation ofInternational Patent Application No. PCT/US2012/041749 filed Jun. 8,2012 and entitled “NON-UNIFORMITY CORRECTION TECHNIQUES FOR INFRAREDIMAGING DEVICES” which is hereby incorporated by reference in itsentirety.

International Patent Application No. PCT/US2012/041749 claims thebenefit of U.S. Provisional Patent Application No. 61/545,056 filed Oct.7, 2011 and entitled “NON-UNIFORMITY CORRECTION TECHNIQUES FOR INFRAREDIMAGING DEVICES” which is hereby incorporated by reference in itsentirety.

International Patent Application No. PCT/US2012/041749 claims thebenefit of U.S. Provisional Patent Application No. 61/495,873 filed Jun.10, 2011 and entitled “INFRARED CAMERA PACKAGING SYSTEMS AND METHODS”which is hereby incorporated by reference in its entirety.

International Patent Application No. PCT/US2012/041749 claims thebenefit of U.S. Provisional Patent Application No. 61/495,879 filed Jun.10, 2011 and entitled “INFRARED CAMERA SYSTEM ARCHITECTURES” which ishereby incorporated by reference in its entirety.

International Patent Application No. PCT/US2012/041749 claims thebenefit of U.S. Provisional Patent Application No. 61/495,888 filed Jun.10, 2011 and entitled “INFRARED CAMERA CALIBRATION TECHNIQUES” which ishereby incorporated by reference in its entirety.

U.S. patent application Ser. No. 14/281,883 is also acontinuation-in-part of U.S. patent application Ser. No. 14/101,258filed Dec. 9, 2013 and entitled “INFRARED CAMERA SYSTEM ARCHITECTURES”which is hereby incorporated by reference in its entirety.

U.S. patent application Ser. No. 14/101,258 is a continuation ofInternational Patent Application No. PCT/US2012/041739 filed Jun. 8,2012 and entitled “INFRARED CAMERA SYSTEM ARCHITECTURES” which is herebyincorporated by reference in its entirety.

International Patent Application No. PCT/US2012/041739 claims thebenefit of U.S. Provisional Patent Application No. 61/495,873 filed Jun.10, 2011 and entitled “INFRARED CAMERA PACKAGING SYSTEMS AND METHODS”which is hereby incorporated by reference in its entirety.

International Patent Application No. PCT/US2012/041739 claims thebenefit of U.S. Provisional Patent Application No. 61/495,879 filed Jun.10, 2011 and entitled “INFRARED CAMERA SYSTEM ARCHITECTURES” which ishereby incorporated by reference in its entirety.

International Patent Application No. PCT/US2012/041739 claims thebenefit of U.S. Provisional Patent Application No. 61/495,888 filed Jun.10, 2011 and entitled “INFRARED CAMERA CALIBRATION TECHNIQUES” which ishereby incorporated by reference in its entirety.

U.S. patent application Ser. No. 14/281,883 is also acontinuation-in-part of U.S. patent application Ser. No. 13/437,645filed Apr. 2, 2012 and entitled “INFRARED RESOLUTION AND CONTRASTENHANCEMENT WITH FUSION” which is hereby incorporated by reference inits entirety.

U.S. patent application Ser. No. 13/437,645 is a continuation-in-part ofU.S. patent application Ser. No. 13/105,765 filed May 11, 2011 andentitled “INFRARED RESOLUTION AND CONTRAST ENHANCEMENT WITH FUSION”which is hereby incorporated by reference in its entirety.

U.S. patent application Ser. No. 13/437,645 also claims the benefit ofU.S. Provisional Patent Application No. 61/473,207 filed Apr. 8, 2011and entitled “INFRARED RESOLUTION AND CONTRAST ENHANCEMENT WITH FUSION”which is hereby incorporated by reference in its entirety.

U.S. patent application Ser. No. 13/437,645 is also acontinuation-in-part of U.S. patent application Ser. No. 12/766,739filed Apr. 23, 2010 and entitled “INFRARED RESOLUTION AND CONTRASTENHANCEMENT WITH FUSION” which is hereby incorporated by reference inits entirety.

U.S. patent application Ser. No. 13/105,765 is a continuation ofInternational Patent Application No. PCT/EP2011/056432 filed Apr. 21,2011 and entitled “INFRARED RESOLUTION AND CONTRAST ENHANCEMENT WITHFUSION” which is hereby incorporated by reference in its entirety.

U.S. patent application Ser. No. 13/105,765 is also acontinuation-in-part of U.S. patent application Ser. No. 12/766,739which is hereby incorporated by reference in its entirety.

International Patent Application No. PCT/EP2011/056432 is acontinuation-in-part of U.S. patent application Ser. No. 12/766,739which is hereby incorporated by reference in its entirety.

International Patent Application No. PCT/EP2011/056432 also claims thebenefit of U.S. Provisional Patent Application No. 61/473,207 which ishereby incorporated by reference in its entirety.

U.S. patent application Ser. No. 14/281,883 is also acontinuation-in-part of U.S. patent application Ser. No. 14/138,058filed Dec. 21, 2013 and entitled “COMPACT MULTI-SPECTRUM IMAGING WITHFUSION” which is hereby incorporated by reference in its entirety.

U.S. patent application Ser. No. 14/138,058 claims the benefit of U.S.Provisional Patent Application No. 61/748,018 filed Dec. 31, 2012 andentitled “COMPACT MULTI-SPECTRUM IMAGING WITH FUSION” which is herebyincorporated by reference in its entirety.

U.S. patent application Ser. No. 14/281,883 is a continuation-in-part ofU.S. patent application Ser. No. 12/477,828 filed Jun. 3, 2009 andentitled “INFRARED CAMERA SYSTEMS AND METHODS FOR DUAL SENSORAPPLICATIONS” which is hereby incorporated by reference in its entirety.

U.S. patent application Ser. No. 14/281,883 is also acontinuation-in-part of U.S. patent application Ser. No. 14/138,040filed Dec. 21, 2013 and entitled “TIME SPACED INFRARED IMAGEENHANCEMENT” which is hereby incorporated by reference in its entirety.

U.S. patent application Ser. No. 14/138,040 claims the benefit of U.S.Provisional Patent Application No. 61/792,582 filed Mar. 15, 2013 andentitled “TIME SPACED INFRARED IMAGE ENHANCEMENT” which is herebyincorporated by reference in its entirety.

U.S. patent application Ser. No. 14/138,040 also claims the benefit ofU.S. Provisional Patent Application No. 61/746,069 filed Dec. 26, 2012and entitled “TIME SPACED INFRARED IMAGE ENHANCEMENT” which is herebyincorporated by reference in its entirety.

U.S. patent application Ser. No. 14/281,883 is also acontinuation-in-part of U.S. patent application Ser. No. 14/138,052filed Dec. 21, 2013 and entitled “INFRARED IMAGING ENHANCEMENT WITHFUSION” which is hereby incorporated by reference in its entirety.

U.S. patent application Ser. No. 14/138,052 claims the benefit of U.S.Provisional Patent Application No. 61/793,952 filed Mar. 15, 2013 andentitled “INFRARED IMAGING ENHANCEMENT WITH FUSION” which is herebyincorporated by reference in its entirety.

U.S. patent application Ser. No. 14/138,052 also claims the benefit ofU.S. Provisional Patent Application No. 61/746,074 filed Dec. 26, 2012and entitled “INFRARED IMAGING ENHANCEMENT WITH FUSION” which is herebyincorporated by reference in its entirety.

U.S. patent application Ser. No. 14/747,202 is a continuation ofInternational Patent Application No. PCT/US2013/062433 filed Sep. 27,2013 and entitled “DEVICE ATTACHMENT WITH INFRARED IMAGING SENSOR” whichis hereby incorporated by reference in its entirety.

U.S. patent application Ser. No. 14/747,202 is a continuation-in-part ofU.S. patent application Ser. No. 13/901,428 filed May 23, 2013 andentitled “DEVICE ATTACHMENT WITH INFRARED IMAGING SENSOR” which ishereby incorporated by reference in its entirety.

U.S. patent application Ser. No. 13/901,428 claims the benefit of U.S.Provisional Patent Application No. 61/652,075 filed May 25, 2012 andentitled “DEVICE ATTACHMENT WITH INFRARED IMAGING SENSOR” which ishereby incorporated by reference in its entirety.

U.S. patent application Ser. No. 13/901,428 is a continuation-in-part ofU.S. Design patent application No. 29/423,027 filed May 25, 2012 andentitled “DEVICE ATTACHMENT WITH CAMERA” which is hereby incorporated byreference in its entirety.

U.S. patent application Ser. No. 13/901,428 is a continuation-in-part ofInternational Patent Application No. PCT/US2012/041744 filed Jun. 8,2012 and entitled “LOW POWER AND SMALL FORM FACTOR INFRARED IMAGING,”which is incorporated herein by reference in its entirety.

U.S. patent application Ser. No. 13/901,428 is a continuation-in-part ofInternational Patent Application No. PCT/US2012/041749 filed Jun. 8,2012 and entitled “NON-UNIFORMITY CORRECTION TECHNIQUES FOR INFRAREDIMAGING DEVICES,” which is incorporated herein by reference in itsentirety.

U.S. patent application Ser. No. 13/901,428 is a continuation-in-part ofInternational Patent Application No. PCT/US2012/041739 filed Jun. 8,2012 and entitled “INFRARED CAMERA SYSTEM ARCHITECTURES,” which ishereby incorporated by reference in its entirety.

U.S. patent application Ser. No. 13/901,428 is a continuation-in-part ofU.S. patent application Ser. No. 13/622,178 filed Sep. 18, 2012 andentitled “SYSTEMS AND METHODS FOR PROCESSING INFRARED IMAGES,” which isa continuation-in-part of U.S. patent application Ser. No. 13/529,772filed Jun. 21, 2012 and entitled “SYSTEMS AND METHODS FOR PROCESSINGINFRARED IMAGES,” which is a continuation of U.S. patent applicationSer. No. 12/396,340 filed Mar. 2, 2009 and entitled “SYSTEMS AND METHODSFOR PROCESSING INFRARED IMAGES,” which are incorporated herein byreference in their entirety.

International Patent Application No. PCT/US2013/062433 claims thebenefit of U.S. Provisional Patent Application No. 61/792,582 filed Mar.15, 2013 and entitled “TIME SPACED INFRARED IMAGE ENHANCEMENT” which ishereby incorporated by reference in its entirety.

International Patent Application No. PCT/US2013/062433 claims thebenefit of U.S. Provisional Patent Application No. 61/748,018 filed Dec.31, 2012 and entitled “COMPACT MULTI-SPECTRUM IMAGING WITH FUSION” whichis hereby incorporated by reference in its entirety.

International Patent Application No. PCT/US2013/062433 claims thebenefit of U.S. Provisional Patent Application No. 61/746,069 filed Dec.26, 2012 and entitled “TIME SPACED INFRARED IMAGE ENHANCEMENT” which ishereby incorporated by reference in its entirety.

TECHNICAL FIELD

One or more embodiments of the invention relate generally to infraredimaging devices and more particularly, for example, to infrared imagingdevices for portable equipments and, for example, to systems and methodsfor multi-spectrum imaging using infrared imaging devices.

BACKGROUND

Various types of portable electronic devices, such as smart phones, cellphones, tablet devices, portable media players, portable game devices,digital cameras, and laptop computers, are in widespread use. Thesedevices typically include a visible-light image sensor or camera thatallows users to take a still picture or a video clip. One of the reasonsfor the increasing popularity of such embedded cameras may be theubiquitous nature of mobile phones and other portable electronicdevices. That is, because users may already be carrying mobile phonesand other portable electronic devices, such embedded cameras are alwaysat hand when users need one. Another reason for the increasingpopularity may be the increasing processing power, storage capacity,and/or display capability that allow sufficiently fast capturing,processing, and storage of large, high quality images using mobilephones and other portable electronic devices.

However, image sensors used in these portable electronic devices aretypically CCD-based or CMOS-based sensors limited to capturing visiblelight images. As such, these sensors may at best detect only a verylimited range of visible light or wavelengths close to visible light(e.g., near infrared light when objects are actively illuminated withinfrared light). In contrast, true infrared image sensors can captureimages of thermal energy radiation emitted from all objects having atemperature above absolute zero, and thus can be used to produceinfrared images (e.g., thermograms) that can be beneficially used in avariety of situations, including viewing in a low or no light condition,detecting body temperature anomalies in people (e.g., for detectingillness), detecting invisible gases, inspecting structures for waterleaks and damaged insulation, detecting electrical and mechanicalequipment for unseen damages, and other situations where true infraredimages may provide useful information. Even though mobile phones andother portable electronic devices capable of processing, displaying, andstoring infrared images are in widespread daily use, these devices arenot being utilized for infrared imaging due to a lack of a true infraredimaging sensor.

SUMMARY

Various techniques are disclosed for providing a device attachmentconfigured to releasably attach to and provide infrared imagingfunctionality to mobile phones or other portable electronic devices. Forexample, a device attachment may include a housing with a partialenclosure (e.g., a tub or cutout) on a rear surface thereof shaped to atleast partially receive a user device, an infrared sensor assemblydisposed within the housing and configured to capture thermal infraredimage data, and a processing module communicatively coupled to theinfrared sensor assembly and configured to transmit the thermal infraredimage data to the user device. Thermal infrared image data may becaptured by the infrared sensor assembly and transmitted to the userdevice by the processing module in response to a request transmitted byan application program or other software/hardware routines running onthe user device. The thermal infrared image data may be transmitted tothe user device via a device connector or a wireless connection.

In one embodiment, a device attachment includes a housing configured toreleasably attach to a user device; an infrared sensor assembly withinthe housing, the infrared sensor assembly configured to capture thermalinfrared image data; and a processing module communicatively coupled tothe infrared sensor assembly and configured to transmit the thermalinfrared image data to the user device.

In another embodiment, a method of providing infrared imagingfunctionality for a user device includes releasably attaching to theuser device a device attachment comprising an infrared sensor assemblyand a processing module; capturing thermal infrared image data at theinfrared sensor assembly; and transmitting the thermal infrared imagedata to the user device using the processing module.

The scope of the invention is defined by the claims, which areincorporated into this section by reference. A more completeunderstanding of embodiments of the invention will be afforded to thoseskilled in the art, as well as a realization of additional advantagesthereof, by a consideration of the following detailed description of oneor more embodiments. Reference will be made to the appended sheets ofdrawings that will first be described briefly.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an infrared imaging module configured to beimplemented in a host device in accordance with an embodiment of thedisclosure.

FIG. 2 illustrates an assembled infrared imaging module in accordancewith an embodiment of the disclosure.

FIG. 3 illustrates an exploded view of an infrared imaging modulejuxtaposed over a socket in accordance with an embodiment of thedisclosure.

FIG. 4 illustrates a block diagram of an infrared sensor assemblyincluding an array of infrared sensors in accordance with an embodimentof the disclosure.

FIG. 5 illustrates a flow diagram of various operations to determine NUCterms in accordance with an embodiment of the disclosure.

FIG. 6 illustrates differences between neighboring pixels in accordancewith an embodiment of the disclosure.

FIG. 7 illustrates a flat field correction technique in accordance withan embodiment of the disclosure.

FIG. 8 illustrates various image processing techniques of FIG. 5 andother operations applied in an image processing pipeline in accordancewith an embodiment of the disclosure.

FIG. 9 illustrates a temporal noise reduction process in accordance withan embodiment of the disclosure.

FIG. 10 illustrates particular implementation details of severalprocesses of the image processing pipeline of FIG. 6 in accordance withan embodiment of the disclosure.

FIG. 11 illustrates spatially correlated FPN in a neighborhood of pixelsin accordance with an embodiment of the disclosure.

FIG. 12 illustrates a rear-left-bottom perspective view of a deviceattachment having an infrared sensor assembly in accordance with anembodiment of the disclosure.

FIG. 13 illustrates a rear-left-bottom perspective view of a deviceattachment having an infrared sensor assembly, showing a user devicereleasably attached thereto in accordance with an embodiment of thedisclosure.

FIG. 14 illustrates a front elevational view of a device attachmenthaving an infrared sensor assembly in accordance with an embodiment ofthe disclosure.

FIG. 15 illustrates a rear elevational view of a device attachmenthaving an infrared sensor assembly in accordance with an embodiment ofthe disclosure.

FIG. 16 illustrates a left side elevational view of a device attachmenthaving an infrared sensor assembly in accordance with an embodiment ofthe disclosure.

FIG. 17 illustrates a right side elevational view of a device attachmenthaving an infrared sensor assembly in accordance with an embodiment ofthe disclosure.

FIG. 18 illustrates a top plan view of a device attachment having aninfrared sensor assembly in accordance with an embodiment of thedisclosure.

FIG. 19 illustrates a bottom plan view of a device attachment having aninfrared sensor assembly in accordance with an embodiment of thedisclosure.

FIG. 20 illustrates a front-left-top perspective view of a deviceattachment having an infrared sensor assembly in accordance with anotherembodiment of the disclosure.

FIG. 21 illustrates a rear-left-bottom perspective view of a deviceattachment having an infrared sensor assembly in accordance with anotherembodiment of the disclosure.

FIG. 22 illustrates a rear view of a device attachment having aninfrared sensor assembly, showing a user device releasably attachedthereto in accordance with another embodiment of the disclosure.

FIG. 23 illustrates a flow diagram showing how thermal images andnon-thermal images can be combined to form processed images inaccordance with an embodiment of the disclosure.

FIG. 24 illustrates a block diagram of a device and a device attachmentshowing how non-thermal images from a non-thermal camera module in thedevice may be combined with thermal images from the device attachmentusing a processor of the device in accordance with an embodiment of thedisclosure.

FIG. 25 illustrates a block diagram of a device and a device attachmentshowing how non-thermal images from a non-thermal camera module in thedevice may be combined with thermal images from the device attachmentusing a processor of the device attachment in accordance with anembodiment of the disclosure.

FIG. 26 illustrates a block diagram of a device and a device attachmentshowing how non-thermal images from a non-thermal camera module in thedevice attachment may be combined with thermal images from the deviceattachment in accordance with an embodiment of the disclosure.

FIG. 27 illustrates a process for capturing and combining thermal andnon-thermal images using a device and a device attachment in accordancewith an embodiment of the disclosure.

FIG. 28 illustrates a front perspective view of a device attachment inaccordance with an embodiment of the disclosure.

FIG. 29 illustrates a rear perspective view of a device attachment inaccordance with an embodiment of the disclosure.

FIG. 30 illustrates a front perspective view of a device attachment inaccordance with an embodiment of the disclosure.

FIG. 31 illustrates a rear perspective view of a device attachment inaccordance with an embodiment of the disclosure.

FIG. 32 illustrates a block diagram of another implementation of aninfrared sensor assembly including an array of infrared sensors and alow-dropout regulator in accordance with an embodiment of thedisclosure.

FIG. 33 illustrates a circuit diagram of a portion of the infraredsensor assembly of FIG. 32 in accordance with an embodiment of thedisclosure.

FIG. 34 illustrates a block diagram of an imaging system adapted toimage a scene in accordance with an embodiment of the disclosure.

FIG. 35 illustrates a flow diagram of various operations to enhanceinfrared imaging of a scene in accordance with an embodiment of thedisclosure.

FIG. 36 illustrates a flow diagram of various operations to combinethermal images and non-thermal images in accordance with an embodimentof the disclosure.

FIG. 37 illustrates a block diagram of an imaging system adapted toimage a scene in accordance with an embodiment of the disclosure.

FIG. 38 illustrates a block diagram of a mounting system for imagingmodules adapted to image a scene in accordance with an embodiment of thedisclosure.

FIG. 39 illustrates a block diagram of an arrangement of an imagingmodule adapted to image a scene in accordance with an embodiment of thedisclosure.

FIG. 40 illustrates a block diagram of an arrangement of an imagingmodule adapted to image a scene in accordance with an embodiment of thedisclosure.

Embodiments of the invention and their advantages are best understood byreferring to the detailed description that follows. It should beappreciated that like reference numerals are used to identify likeelements illustrated in one or more of the figures.

DETAILED DESCRIPTION

FIG. 1 illustrates an infrared imaging module 100 (e.g., an infraredcamera or an infrared imaging device) configured to be implemented in ahost device 102 in accordance with an embodiment of the disclosure.Infrared imaging module 100 may be implemented, for one or moreembodiments, with a small form factor and in accordance with wafer levelpackaging techniques or other packaging techniques.

In one embodiment, infrared imaging module 100 may be configured to beimplemented in a small portable host device 102, such as a mobiletelephone, a tablet computing device, a laptop computing device, apersonal digital assistant, a visible light camera, a music player, orany other appropriate mobile device (e.g., any type of mobile personalelectronic device). In this regard, infrared imaging module 100 may beused to provide infrared imaging features to host device 102. Forexample, infrared imaging module 100 may be configured to capture,process, and/or otherwise manage infrared images and provide suchinfrared images to host device 102 for use in any desired fashion (e.g.,for further processing, to store in memory, to display, to use byvarious applications running on host device 102, to export to otherdevices, or other uses).

In various embodiments, infrared imaging module 100 may be configured tooperate at low voltage levels and over a wide temperature range. Forexample, in one embodiment, infrared imaging module 100 may operateusing a power supply of approximately 2.4 volts, 2.5 volts, 2.8 volts,or lower voltages, and operate over a temperature range of approximately−20 degrees C. to approximately +60 degrees C. (e.g., providing asuitable dynamic range and performance over an environmental temperaturerange of approximately 80 degrees C.). In one embodiment, by operatinginfrared imaging module 100 at low voltage levels, infrared imagingmodule 100 may experience reduced amounts of self heating in comparisonwith other types of infrared imaging devices. As a result, infraredimaging module 100 may be operated with reduced measures to compensatefor such self heating.

As shown in FIG. 1, host device 102 may include a socket 104, a shutter105, motion sensors 194, a processor 195, a memory 196, a display 197,and/or other components 198. Socket 104 may be configured to receiveinfrared imaging module 100 as identified by arrow 101. In this regard,FIG. 2 illustrates infrared imaging module 100 assembled in socket 104in accordance with an embodiment of the disclosure.

Motion sensors 194 may be implemented by one or more accelerometers,gyroscopes, or other appropriate devices that may be used to detectmovement of host device 102. Motion sensors 194 may be monitored by andprovide information to processing module 160 or processor 195 to detectmotion. In various embodiments, motion sensors 194 may be implemented aspart of host device 102 (as shown in FIG. 1), infrared imaging module100, or other devices attached to or otherwise interfaced with hostdevice 102.

Processor 195 may be implemented as any appropriate processing device(e.g., logic deice, microcontroller, processor, application specificintegrated circuit (ASIC), or other device) that may be used by hostdevice 102 to execute appropriate instructions, such as softwareinstructions provided in memory 196. Display 197 may be used to displaycaptured and/or processed infrared images and/or other images, data, andinformation. Other components 198 may be used to implement any featuresof host device 102 as may be desired for various applications (e.g.,clocks, temperature sensors, a visible light camera, or othercomponents). In addition, a machine readable medium 193 may be providedfor storing non-transitory instructions for loading into memory 196 andexecution by processor 195.

In various embodiments, infrared imaging module 100 and socket 104 maybe implemented for mass production to facilitate high volumeapplications, such as for implementation in mobile telephones or otherdevices (e.g., requiring small form factors). In one embodiment, thecombination of infrared imaging module 100 and socket 104 may exhibitoverall dimensions of approximately 8.5 mm by 8.5 mm by 5.9 mm whileinfrared imaging module 100 is installed in socket 104.

FIG. 3 illustrates an exploded view of infrared imaging module 100juxtaposed over socket 104 in accordance with an embodiment of thedisclosure. Infrared imaging module 100 may include a lens barrel 110, ahousing 120, an infrared sensor assembly 128, a circuit board 170, abase 150, and a processing module 160.

Lens barrel 110 may at least partially enclose an optical element 180(e.g., a lens) which is partially visible in FIG. 3 through an aperture112 in lens barrel 110. Lens barrel 110 may include a substantiallycylindrical extension 114 which may be used to interface lens barrel 110with an aperture 122 in housing 120.

Infrared sensor assembly 128 may be implemented, for example, with a cap130 (e.g., a lid) mounted on a substrate 140. Infrared sensor assembly128 may include a plurality of infrared sensors 132 (e.g., infrareddetectors) implemented in an array or other fashion on substrate 140 andcovered by cap 130. For example, in one embodiment, infrared sensorassembly 128 may be implemented as a focal plane array (FPA). Such afocal plane array may be implemented, for example, as a vacuum packageassembly (e.g., sealed by cap 130 and substrate 140). In one embodiment,infrared sensor assembly 128 may be implemented as a wafer level package(e.g., infrared sensor assembly 128 may be singulated from a set ofvacuum package assemblies provided on a wafer). In one embodiment,infrared sensor assembly 128 may be implemented to operate using a powersupply of approximately 2.4 volts, 2.5 volts, 2.8 volts, or similarvoltages.

Infrared sensors 132 may be configured to detect infrared radiation(e.g., infrared energy) from a target scene including, for example, midwave infrared wave bands (MWIR), long wave infrared wave bands (LWIR),and/or other thermal imaging bands as may be desired in particularimplementations. In one embodiment, infrared sensor assembly 128 may beprovided in accordance with wafer level packaging techniques.

Infrared sensors 132 may be implemented, for example, as microbolometersor other types of thermal imaging infrared sensors arranged in anydesired array pattern to provide a plurality of pixels. In oneembodiment, infrared sensors 132 may be implemented as vanadium oxide(VOx) detectors with a 17 μm pixel pitch. In various embodiments, arraysof approximately 32 by 32 infrared sensors 132, approximately 64 by 64infrared sensors 132, approximately 80 by 64 infrared sensors 132, orother array sizes may be used.

Substrate 140 may include various circuitry including, for example, aread out integrated circuit (ROTC) with dimensions less thanapproximately 5.5 mm by 5.5 mm in one embodiment. Substrate 140 may alsoinclude bond pads 142 that may be used to contact complementaryconnections positioned on inside surfaces of housing 120 when infraredimaging module 100 is assembled as shown in FIGS. 5A, 5B, and 5C. In oneembodiment, the ROIC may be implemented with low-dropout regulators(LDO) to perform voltage regulation to reduce power supply noiseintroduced to infrared sensor assembly 128 and thus provide an improvedpower supply rejection ratio (PSRR). Moreover, by implementing the LDOwith the ROTC (e.g., within a wafer level package), less die area may beconsumed and fewer discrete die (or chips) are needed.

FIG. 4 illustrates a block diagram of infrared sensor assembly 128including an array of infrared sensors 132 in accordance with anembodiment of the disclosure. In the illustrated embodiment, infraredsensors 132 are provided as part of a unit cell array of a ROIC 402.ROIC 402 includes bias generation and timing control circuitry 404,column amplifiers 405, a column multiplexer 406, a row multiplexer 408,and an output amplifier 410. Image frames (e.g., thermal images)captured by infrared sensors 132 may be provided by output amplifier 410to processing module 160, processor 195, and/or any other appropriatecomponents to perform various processing techniques described herein.Although an 8 by 8 array is shown in FIG. 4, any desired arrayconfiguration may be used in other embodiments. Further descriptions ofROICs and infrared sensors (e.g., microbolometer circuits) may be foundin U.S. Pat. No. 6,028,309 issued Feb. 22, 2000, which is incorporatedherein by reference in its entirety.

Infrared sensor assembly 128 may capture images (e.g., image frames) andprovide such images from its ROIC at various rates. Processing module160 may be used to perform appropriate processing of captured infraredimages and may be implemented in accordance with any appropriatearchitecture. In one embodiment, processing module 160 may beimplemented as an ASIC. In this regard, such an ASIC may be configuredto perform image processing with high performance and/or highefficiency. In another embodiment, processing module 160 may beimplemented with a general purpose central processing unit (CPU) whichmay be configured to execute appropriate software instructions toperform image processing, coordinate and perform image processing withvarious image processing blocks, coordinate interfacing betweenprocessing module 160 and host device 102, and/or other operations. Inyet another embodiment, processing module 160 may be implemented with afield programmable gate array (FPGA). Processing module 160 may beimplemented with other types of processing and/or logic circuits inother embodiments as would be understood by one skilled in the art.

In these and other embodiments, processing module 160 may also beimplemented with other components where appropriate, such as, volatilememory, non-volatile memory, and/or one or more interfaces (e.g.,infrared detector interfaces, inter-integrated circuit (I2C) interfaces,mobile industry processor interfaces (MIPI), joint test action group(JTAG) interfaces (e.g., IEEE 1149.1 standard test access port andboundary-scan architecture), and/or other interfaces).

In some embodiments, infrared imaging module 100 may further include oneor more actuators 199 which may be used to adjust the focus of infraredimage frames captured by infrared sensor assembly 128. For example,actuators 199 may be used to move optical element 180, infrared sensors132, and/or other components relative to each other to selectively focusand defocus infrared image frames in accordance with techniquesdescribed herein. Actuators 199 may be implemented in accordance withany type of motion-inducing apparatus or mechanism, and may positionedat any location within or external to infrared imaging module 100 asappropriate for different applications.

When infrared imaging module 100 is assembled, housing 120 maysubstantially enclose infrared sensor assembly 128, base 150, andprocessing module 160. Housing 120 may facilitate connection of variouscomponents of infrared imaging module 100. For example, in oneembodiment, housing 120 may provide electrical connections 126 toconnect various components as further described.

Electrical connections 126 (e.g., conductive electrical paths, traces,or other types of connections) may be electrically connected with bondpads 142 when infrared imaging module 100 is assembled. In variousembodiments, electrical connections 126 may be embedded in housing 120,provided on inside surfaces of housing 120, and/or otherwise provided byhousing 120. Electrical connections 126 may terminate in connections 124protruding from the bottom surface of housing 120 as shown in FIG. 3.Connections 124 may connect with circuit board 170 when infrared imagingmodule 100 is assembled (e.g., housing 120 may rest atop circuit board170 in various embodiments). Processing module 160 may be electricallyconnected with circuit board 170 through appropriate electricalconnections. As a result, infrared sensor assembly 128 may beelectrically connected with processing module 160 through, for example,conductive electrical paths provided by: bond pads 142, complementaryconnections on inside surfaces of housing 120, electrical connections126 of housing 120, connections 124, and circuit board 170.Advantageously, such an arrangement may be implemented without requiringwire bonds to be provided between infrared sensor assembly 128 andprocessing module 160.

In various embodiments, electrical connections 126 in housing 120 may bemade from any desired material (e.g., copper or any other appropriateconductive material). In one embodiment, electrical connections 126 mayaid in dissipating heat from infrared imaging module 100.

Other connections may be used in other embodiments. For example, in oneembodiment, sensor assembly 128 may be attached to processing module 160through a ceramic board that connects to sensor assembly 128 by wirebonds and to processing module 160 by a ball grid array (BGA). Inanother embodiment, sensor assembly 128 may be mounted directly on arigid flexible board and electrically connected with wire bonds, andprocessing module 160 may be mounted and connected to the rigid flexibleboard with wire bonds or a BGA.

The various implementations of infrared imaging module 100 and hostdevice 102 set forth herein are provided for purposes of example, ratherthan limitation. In this regard, any of the various techniques describedherein may be applied to any infrared camera system, infrared imager, orother device for performing infrared/thermal imaging.

Substrate 140 of infrared sensor assembly 128 may be mounted on base150. In various embodiments, base 150 (e.g., a pedestal) may be made,for example, of copper formed by metal injection molding (MIM) andprovided with a black oxide or nickel-coated finish. In variousembodiments, base 150 may be made of any desired material, such as forexample zinc, aluminum, or magnesium, as desired for a given applicationand may be formed by any desired applicable process, such as for examplealuminum casting, MIM, or zinc rapid casting, as may be desired forparticular applications. In various embodiments, base 150 may beimplemented to provide structural support, various circuit paths,thermal heat sink properties, and other features where appropriate. Inone embodiment, base 150 may be a multi-layer structure implemented atleast in part using ceramic material.

In various embodiments, circuit board 170 may receive housing 120 andthus may physically support the various components of infrared imagingmodule 100. In various embodiments, circuit board 170 may be implementedas a printed circuit board (e.g., an FR4 circuit board or other types ofcircuit boards), a rigid or flexible interconnect (e.g., tape or othertype of interconnects), a flexible circuit substrate, a flexible plasticsubstrate, or other appropriate structures. In various embodiments, base150 may be implemented with the various features and attributesdescribed for circuit board 170, and vice versa.

Socket 104 may include a cavity 106 configured to receive infraredimaging module 100 (e.g., as shown in the assembled view of FIG. 2).Infrared imaging module 100 and/or socket 104 may include appropriatetabs, arms, pins, fasteners, or any other appropriate engagement memberswhich may be used to secure infrared imaging module 100 to or withinsocket 104 using friction, tension, adhesion, and/or any otherappropriate manner. Socket 104 may include engagement members 107 thatmay engage surfaces 109 of housing 120 when infrared imaging module 100is inserted into a cavity 106 of socket 104. Other types of engagementmembers may be used in other embodiments.

Infrared imaging module 100 may be electrically connected with socket104 through appropriate electrical connections (e.g., contacts, pins,wires, or any other appropriate connections). For example, socket 104may include electrical connections 108 which may contact correspondingelectrical connections of infrared imaging module 100 (e.g.,interconnect pads, contacts, or other electrical connections on side orbottom surfaces of circuit board 170, bond pads 142 or other electricalconnections on base 150, or other connections). Electrical connections108 may be made from any desired material (e.g., copper or any otherappropriate conductive material). In one embodiment, electricalconnections 108 may be mechanically biased to press against electricalconnections of infrared imaging module 100 when infrared imaging module100 is inserted into cavity 106 of socket 104. In one embodiment,electrical connections 108 may at least partially secure infraredimaging module 100 in socket 104. Other types of electrical connectionsmay be used in other embodiments.

Socket 104 may be electrically connected with host device 102 throughsimilar types of electrical connections. For example, in one embodiment,host device 102 may include electrical connections (e.g., solderedconnections, snap-in connections, or other connections) that connectwith electrical connections 108 passing through apertures 190. Invarious embodiments, such electrical connections may be made to thesides and/or bottom of socket 104.

Various components of infrared imaging module 100 may be implementedwith flip chip technology which may be used to mount components directlyto circuit boards without the additional clearances typically needed forwire bond connections. Flip chip connections may be used, as an example,to reduce the overall size of infrared imaging module 100 for use incompact small form factor applications. For example, in one embodiment,processing module 160 may be mounted to circuit board 170 using flipchip connections. For example, infrared imaging module 100 may beimplemented with such flip chip configurations.

In various embodiments, infrared imaging module 100 and/or associatedcomponents may be implemented in accordance with various techniques(e.g., wafer level packaging techniques) as set forth in U.S. patentapplication Ser. No. 12/844,124 filed Jul. 27, 2010, and U.S.Provisional Patent Application No. 61/469,651 filed Mar. 30, 2011, whichare incorporated herein by reference in their entirety. Furthermore, inaccordance with one or more embodiments, infrared imaging module 100and/or associated components may be implemented, calibrated, tested,and/or used in accordance with various techniques, such as for exampleas set forth in U.S. Pat. No. 7,470,902 issued Dec. 30, 2008, U.S. Pat.No. 6,028,309 issued Feb. 22, 2000, U.S. Pat. No. 6,812,465 issued Nov.2, 2004, U.S. Pat. No. 7,034,301 issued Apr. 25, 2006, U.S. Pat. No.7,679,048 issued Mar. 16, 2010, U.S. Pat. No. 7,470,904 issued Dec. 30,2008, U.S. patent application Ser. No. 12/202,880 filed Sep. 2, 2008,and U.S. patent application Ser. No. 12/202,896 filed Sep. 2, 2008,which are incorporated herein by reference in their entirety.

Referring again to FIG. 1, in various embodiments, host device 102 mayinclude shutter 105. In this regard, shutter 105 may be selectivelypositioned over socket 104 (e.g., as identified by arrows 103) whileinfrared imaging module 100 is installed therein. In this regard,shutter 105 may be used, for example, to protect infrared imaging module100 when not in use. Shutter 105 may also be used as a temperaturereference as part of a calibration process (e.g., a NUC process or othercalibration processes) for infrared imaging module 100 as would beunderstood by one skilled in the art.

In various embodiments, shutter 105 may be made from various materialssuch as, for example, polymers, glass, aluminum (e.g., painted oranodized) or other materials. In various embodiments, shutter 105 mayinclude one or more coatings to selectively filter electromagneticradiation and/or adjust various optical properties of shutter 105 (e.g.,a uniform blackbody coating or a reflective gold coating).

In another embodiment, shutter 105 may be fixed in place to protectinfrared imaging module 100 at all times. In this case, shutter 105 or aportion of shutter 105 may be made from appropriate materials (e.g.,polymers or infrared transmitting materials such as silicon, germanium,zinc selenide, or chalcogenide glasses) that do not substantially filterdesired infrared wavelengths. In another embodiment, a shutter may beimplemented as part of infrared imaging module 100 (e.g., within or aspart of a lens barrel or other components of infrared imaging module100), as would be understood by one skilled in the art.

Alternatively, in another embodiment, a shutter (e.g., shutter 105 orother type of external or internal shutter) need not be provided, butrather a NUC process or other type of calibration may be performed usingshutterless techniques. In another embodiment, a NUC process or othertype of calibration using shutterless techniques may be performed incombination with shutter-based techniques.

Infrared imaging module 100 and host device 102 may be implemented inaccordance with any of the various techniques set forth in U.S.Provisional Patent Application No. 61/495,873 filed Jun. 10, 2011, U.S.Provisional Patent Application No. 61/495,879 filed Jun. 10, 2011, andU.S. Provisional Patent Application No. 61/495,888 filed Jun. 10, 2011,which are incorporated herein by reference in their entirety.

In various embodiments, the components of host device 102 and/orinfrared imaging module 100 may be implemented as a local or distributedsystem with components in communication with each other over wiredand/or wireless networks. Accordingly, the various operations identifiedin this disclosure may be performed by local and/or remote components asmay be desired in particular implementations.

FIG. 5 illustrates a flow diagram of various operations to determine NUCterms in accordance with an embodiment of the disclosure. In someembodiments, the operations of FIG. 5 may be performed by processingmodule 160 or processor 195 (both also generally referred to as aprocessor) operating on image frames captured by infrared sensors 132.

In block 505, infrared sensors 132 begin capturing image frames of ascene. Typically, the scene will be the real world environment in whichhost device 102 is currently located. In this regard, shutter 105 (ifoptionally provided) may be opened to permit infrared imaging module toreceive infrared radiation from the scene. Infrared sensors 132 maycontinue capturing image frames during all operations shown in FIG. 5.In this regard, the continuously captured image frames may be used forvarious operations as further discussed. In one embodiment, the capturedimage frames may be temporally filtered (e.g., in accordance with theprocess of block 826 further described herein with regard to FIG. 8) andbe processed by other terms (e.g., factory gain terms 812, factoryoffset terms 816, previously determined NUC terms 817, column FPN terms820, and row FPN terms 824 as further described herein with regard toFIG. 8) before they are used in the operations shown in FIG. 5.

In block 510, a NUC process initiating event is detected. In oneembodiment, the NUC process may be initiated in response to physicalmovement of host device 102. Such movement may be detected, for example,by motion sensors 194 which may be polled by a processor. In oneexample, a user may move host device 102 in a particular manner, such asby intentionally waving host device 102 back and forth in an “erase” or“swipe” movement. In this regard, the user may move host device 102 inaccordance with a predetermined speed and direction (velocity), such asin an up and down, side to side, or other pattern to initiate the NUCprocess. In this example, the use of such movements may permit the userto intuitively operate host device 102 to simulate the “erasing” ofnoise in captured image frames.

In another example, a NUC process may be initiated by host device 102 ifmotion exceeding a threshold value is exceeded (e.g., motion greaterthan expected for ordinary use). It is contemplated that any desiredtype of spatial translation of host device 102 may be used to initiatethe NUC process.

In yet another example, a NUC process may be initiated by host device102 if a minimum time has elapsed since a previously performed NUCprocess. In a further example, a NUC process may be initiated by hostdevice 102 if infrared imaging module 100 has experienced a minimumtemperature change since a previously performed NUC process. In a stillfurther example, a NUC process may be continuously initiated andrepeated.

In block 515, after a NUC process initiating event is detected, it isdetermined whether the NUC process should actually be performed. In thisregard, the NUC process may be selectively initiated based on whetherone or more additional conditions are met. For example, in oneembodiment, the NUC process may not be performed unless a minimum timehas elapsed since a previously performed NUC process. In anotherembodiment, the NUC process may not be performed unless infrared imagingmodule 100 has experienced a minimum temperature change since apreviously performed NUC process. Other criteria or conditions may beused in other embodiments. If appropriate criteria or conditions havebeen met, then the flow diagram continues to block 520. Otherwise, theflow diagram returns to block 505.

In the NUC process, blurred image frames may be used to determine NUCterms which may be applied to captured image frames to correct for FPN.As discussed, in one embodiment, the blurred image frames may beobtained by accumulating multiple image frames of a moving scene (e.g.,captured while the scene and/or the thermal imager is in motion). Inanother embodiment, the blurred image frames may be obtained bydefocusing an optical element or other component of the thermal imager.

Accordingly, in block 520 a choice of either approach is provided. Ifthe motion-based approach is used, then the flow diagram continues toblock 525. If the defocus-based approach is used, then the flow diagramcontinues to block 530.

Referring now to the motion-based approach, in block 525 motion isdetected. For example, in one embodiment, motion may be detected basedon the image frames captured by infrared sensors 132. In this regard, anappropriate motion detection process (e.g., an image registrationprocess, a frame-to-frame difference calculation, or other appropriateprocess) may be applied to captured image frames to determine whethermotion is present (e.g., whether static or moving image frames have beencaptured). For example, in one embodiment, it can be determined whetherpixels or regions around the pixels of consecutive image frames havechanged more than a user defined amount (e.g., a percentage and/orthreshold value). If at least a given percentage of pixels have changedby at least the user defined amount, then motion will be detected withsufficient certainty to proceed to block 535.

In another embodiment, motion may be determined on a per pixel basis,wherein only pixels that exhibit significant changes are accumulated toprovide the blurred image frame. For example, counters may be providedfor each pixel and used to ensure that the same number of pixel valuesare accumulated for each pixel, or used to average the pixel valuesbased on the number of pixel values actually accumulated for each pixel.Other types of image-based motion detection may be performed such asperforming a Radon transform.

In another embodiment, motion may be detected based on data provided bymotion sensors 194. In one embodiment, such motion detection may includedetecting whether host device 102 is moving along a relatively straighttrajectory through space. For example, if host device 102 is movingalong a relatively straight trajectory, then it is possible that certainobjects appearing in the imaged scene may not be sufficiently blurred(e.g., objects in the scene that may be aligned with or movingsubstantially parallel to the straight trajectory). Thus, in such anembodiment, the motion detected by motion sensors 194 may be conditionedon host device 102 exhibiting, or not exhibiting, particulartrajectories.

In yet another embodiment, both a motion detection process and motionsensors 194 may be used. Thus, using any of these various embodiments, adetermination can be made as to whether or not each image frame wascaptured while at least a portion of the scene and host device 102 werein motion relative to each other (e.g., which may be caused by hostdevice 102 moving relative to the scene, at least a portion of the scenemoving relative to host device 102, or both).

It is expected that the image frames for which motion was detected mayexhibit some secondary blurring of the captured scene (e.g., blurredthermal image data associated with the scene) due to the thermal timeconstants of infrared sensors 132 (e.g., microbolometer thermal timeconstants) interacting with the scene movement.

In block 535, image frames for which motion was detected areaccumulated. For example, if motion is detected for a continuous seriesof image frames, then the image frames of the series may be accumulated.As another example, if motion is detected for only some image frames,then the non-moving image frames may be skipped and not included in theaccumulation. Thus, a continuous or discontinuous set of image framesmay be selected to be accumulated based on the detected motion.

In block 540, the accumulated image frames are averaged to provide ablurred image frame. Because the accumulated image frames were capturedduring motion, it is expected that actual scene information will varybetween the image frames and thus cause the scene information to befurther blurred in the resulting blurred image frame (block 545).

In contrast, FPN (e.g., caused by one or more components of infraredimaging module 100) will remain fixed over at least short periods oftime and over at least limited changes in scene irradiance duringmotion. As a result, image frames captured in close proximity in timeand space during motion will suffer from identical or at least verysimilar FPN. Thus, although scene information may change in consecutiveimage frames, the FPN will stay essentially constant. By averaging,multiple image frames captured during motion will blur the sceneinformation, but will not blur the FPN. As a result, FPN will remainmore clearly defined in the blurred image frame provided in block 545than the scene information.

In one embodiment, 32 or more image frames are accumulated and averagedin blocks 535 and 540. However, any desired number of image frames maybe used in other embodiments, but with generally decreasing correctionaccuracy as frame count is decreased.

Referring now to the defocus-based approach, in block 530, a defocusoperation may be performed to intentionally defocus the image framescaptured by infrared sensors 132. For example, in one embodiment, one ormore actuators 199 may be used to adjust, move, or otherwise translateoptical element 180, infrared sensor assembly 128, and/or othercomponents of infrared imaging module 100 to cause infrared sensors 132to capture a blurred (e.g., unfocused) image frame of the scene. Othernon-actuator based techniques are also contemplated for intentionallydefocusing infrared image frames such as, for example, manual (e.g.,user-initiated) defocusing.

Although the scene may appear blurred in the image frame, FPN (e.g.,caused by one or more components of infrared imaging module 100) willremain unaffected by the defocusing operation. As a result, a blurredimage frame of the scene will be provided (block 545) with FPN remainingmore clearly defined in the blurred image than the scene information.

In the above discussion, the defocus-based approach has been describedwith regard to a single captured image frame. In another embodiment, thedefocus-based approach may include accumulating multiple image frameswhile the infrared imaging module 100 has been defocused and averagingthe defocused image frames to remove the effects of temporal noise andprovide a blurred image frame in block 545.

Thus, it will be appreciated that a blurred image frame may be providedin block 545 by either the motion-based approach or the defocus-basedapproach. Because much of the scene information will be blurred byeither motion, defocusing, or both, the blurred image frame may beeffectively considered a low pass filtered version of the originalcaptured image frames with respect to scene information.

In block 550, the blurred image frame is processed to determine updatedrow and column FPN terms (e.g., if row and column FPN terms have notbeen previously determined then the updated row and column FPN terms maybe new row and column FPN terms in the first iteration of block 550). Asused in this disclosure, the terms row and column may be usedinterchangeably depending on the orientation of infrared sensors 132and/or other components of infrared imaging module 100.

In one embodiment, block 550 includes determining a spatial FPNcorrection term for each row of the blurred image frame (e.g., each rowmay have its own spatial FPN correction term), and also determining aspatial FPN correction term for each column of the blurred image frame(e.g., each column may have its own spatial FPN correction term). Suchprocessing may be used to reduce the spatial and slowly varying (1/f)row and column FPN inherent in thermal imagers caused by, for example,1/f noise characteristics of amplifiers in ROIC 402 which may manifestas vertical and horizontal stripes in image frames.

Advantageously, by determining spatial row and column FPN terms usingthe blurred image frame, there will be a reduced risk of vertical andhorizontal objects in the actual imaged scene from being mistaken forrow and column noise (e.g., real scene content will be blurred while FPNremains unblurred).

In one embodiment, row and column FPN terms may be determined byconsidering differences between neighboring pixels of the blurred imageframe. For example, FIG. 6 illustrates differences between neighboringpixels in accordance with an embodiment of the disclosure. Specifically,in FIG. 6 a pixel 610 is compared to its 8 nearest horizontal neighbors:d0-d3 on one side and d4-d7 on the other side. Differences between theneighbor pixels can be averaged to obtain an estimate of the offseterror of the illustrated group of pixels. An offset error may becalculated for each pixel in a row or column and the average result maybe used to correct the entire row or column.

To prevent real scene data from being interpreted as noise, upper andlower threshold values may be used (thPix and −thPix). Pixel valuesfalling outside these threshold values (pixels dl and d4 in thisexample) are not used to obtain the offset error. In addition, themaximum amount of row and column FPN correction may be limited by thesethreshold values.

Further techniques for performing spatial row and column FPN correctionprocessing are set forth in U.S. patent application Ser. No. 12/396,340filed Mar. 2, 2009 which is incorporated herein by reference in itsentirety.

Referring again to FIG. 5, the updated row and column FPN termsdetermined in block 550 are stored (block 552) and applied (block 555)to the blurred image frame provided in block 545. After these terms areapplied, some of the spatial row and column FPN in the blurred imageframe may be reduced. However, because such terms are applied generallyto rows and columns, additional FPN may remain such as spatiallyuncorrelated FPN associated with pixel to pixel drift or other causes.Neighborhoods of spatially correlated FPN may also remain which may notbe directly associated with individual rows and columns. Accordingly,further processing may be performed as discussed below to determine NUCterms.

In block 560, local contrast values (e.g., edges or absolute values ofgradients between adjacent or small groups of pixels) in the blurredimage frame are determined. If scene information in the blurred imageframe includes contrasting areas that have not been significantlyblurred (e.g., high contrast edges in the original scene data), thensuch features may be identified by a contrast determination process inblock 560.

For example, local contrast values in the blurred image frame may becalculated, or any other desired type of edge detection process may beapplied to identify certain pixels in the blurred image as being part ofan area of local contrast. Pixels that are marked in this manner may beconsidered as containing excessive high spatial frequency sceneinformation that would be interpreted as FPN (e.g., such regions maycorrespond to portions of the scene that have not been sufficientlyblurred). As such, these pixels may be excluded from being used in thefurther determination of NUC terms. In one embodiment, such contrastdetection processing may rely on a threshold that is higher than theexpected contrast value associated with FPN (e.g., pixels exhibiting acontrast value higher than the threshold may be considered to be sceneinformation, and those lower than the threshold may be considered to beexhibiting FPN).

In one embodiment, the contrast determination of block 560 may beperformed on the blurred image frame after row and column FPN terms havebeen applied to the blurred image frame (e.g., as shown in FIG. 5). Inanother embodiment, block 560 may be performed prior to block 550 todetermine contrast before row and column FPN terms are determined (e.g.,to prevent scene based contrast from contributing to the determinationof such terms).

Following block 560, it is expected that any high spatial frequencycontent remaining in the blurred image frame may be generally attributedto spatially uncorrelated FPN. In this regard, following block 560, muchof the other noise or actual desired scene based information has beenremoved or excluded from the blurred image frame due to: intentionalblurring of the image frame (e.g., by motion or defocusing in blocks 520through 545), application of row and column FPN terms (block 555), andcontrast determination of (block 560).

Thus, it can be expected that following block 560, any remaining highspatial frequency content (e.g., exhibited as areas of contrast ordifferences in the blurred image frame) may be attributed to spatiallyuncorrelated FPN. Accordingly, in block 565, the blurred image frame ishigh pass filtered. In one embodiment, this may include applying a highpass filter to extract the high spatial frequency content from theblurred image frame. In another embodiment, this may include applying alow pass filter to the blurred image frame and taking a differencebetween the low pass filtered image frame and the unfiltered blurredimage frame to obtain the high spatial frequency content. In accordancewith various embodiments of the present disclosure, a high pass filtermay be implemented by calculating a mean difference between a sensorsignal (e.g., a pixel value) and its neighbors.

In block 570, a flat field correction process is performed on the highpass filtered blurred image frame to determine updated NUC terms (e.g.,if a NUC process has not previously been performed then the updated NUCterms may be new NUC terms in the first iteration of block 570).

For example, FIG. 7 illustrates a flat field correction technique 700 inaccordance with an embodiment of the disclosure. In FIG. 7, a NUC termmay be determined for each pixel 710 of the blurred image frame usingthe values of its neighboring pixels 712 to 726. For each pixel 710,several gradients may be determined based on the absolute differencebetween the values of various adjacent pixels. For example, absolutevalue differences may be determined between: pixels 712 and 714 (a leftto right diagonal gradient), pixels 716 and 718 (a top to bottomvertical gradient), pixels 720 and 722 (a right to left diagonalgradient), and pixels 724 and 726 (a left to right horizontal gradient)

These absolute differences may be summed to provide a summed gradientfor pixel 710. A weight value may be determined for pixel 710 that isinversely proportional to the summed gradient. This process may beperformed for all pixels 710 of the blurred image frame until a weightvalue is provided for each pixel 710. For areas with low gradients(e.g., areas that are blurry or have low contrast), the weight valuewill be close to one. Conversely, for areas with high gradients, theweight value will be zero or close to zero. The update to the NUC termas estimated by the high pass filter is multiplied with the weightvalue.

In one embodiment, the risk of introducing scene information into theNUC terms can be further reduced by applying some amount of temporaldamping to the NUC term determination process. For example, a temporaldamping factor λ between 0 and 1 may be chosen such that the new NUCterm (NUC_(NEW)) stored is a weighted average of the old NUC term(NUC_(OLD)) and the estimated updated NUC term (NUC_(UPDATE)). In oneembodiment, this can be expressed asNUC_(NEW)=λ·NUC_(OLD)+(1−λ)·(NUC_(OLD)+NUC_(UPDATE)).

Although the determination of NUC terms has been described with regardto gradients, local contrast values may be used instead whereappropriate. Other techniques may also be used such as, for example,standard deviation calculations. Other types flat field correctionprocesses may be performed to determine NUC terms including, forexample, various processes identified in U.S. Pat. No. 6,028,309 issuedFeb. 22, 2000, U.S. Pat. No. 6,812,465 issued Nov. 2, 2004, and U.S.patent application Ser. No. 12/114,865 filed May 5, 2008, which areincorporated herein by reference in their entirety.

Referring again to FIG. 5, block 570 may include additional processingof the NUC terms. For example, in one embodiment, to preserve the scenesignal mean, the sum of all NUC terms may be normalized to zero bysubtracting the NUC term mean from each NUC term. Also in block 570, toavoid row and column noise from affecting the NUC terms, the mean valueof each row and column may be subtracted from the NUC terms for each rowand column. As a result, row and column FPN filters using the row andcolumn FPN terms determined in block 550 may be better able to filterout row and column noise in further iterations (e.g., as further shownin FIG. 8) after the NUC terms are applied to captured images (e.g., inblock 580 further discussed herein). In this regard, the row and columnFPN filters may in general use more data to calculate the per row andper column offset coefficients (e.g., row and column FPN terms) and maythus provide a more robust alternative for reducing spatially correlatedFPN than the NUC terms which are based on high pass filtering to capturespatially uncorrelated noise.

In blocks 571-573, additional high pass filtering and furtherdeterminations of updated NUC terms may be optionally performed toremove spatially correlated FPN with lower spatial frequency thanpreviously removed by row and column FPN terms. In this regard, somevariability in infrared sensors 132 or other components of infraredimaging module 100 may result in spatially correlated FPN noise thatcannot be easily modeled as row or column noise. Such spatiallycorrelated FPN may include, for example, window defects on a sensorpackage or a cluster of infrared sensors 132 that respond differently toirradiance than neighboring infrared sensors 132. In one embodiment,such spatially correlated FPN may be mitigated with an offsetcorrection. If the amount of such spatially correlated FPN issignificant, then the noise may also be detectable in the blurred imageframe. Since this type of noise may affect a neighborhood of pixels, ahigh pass filter with a small kernel may not detect the FPN in theneighborhood (e.g., all values used in high pass filter may be takenfrom the neighborhood of affected pixels and thus may be affected by thesame offset error). For example, if the high pass filtering of block 565is performed with a small kernel (e.g., considering only immediatelyadjacent pixels that fall within a neighborhood of pixels affected byspatially correlated FPN), then broadly distributed spatially correlatedFPN may not be detected.

For example, FIG. 11 illustrates spatially correlated FPN in aneighborhood of pixels in accordance with an embodiment of thedisclosure. As shown in a sample image frame 1100, a neighborhood ofpixels 1110 may exhibit spatially correlated FPN that is not preciselycorrelated to individual rows and columns and is distributed over aneighborhood of several pixels (e.g., a neighborhood of approximately 4by 4 pixels in this example). Sample image frame 1100 also includes aset of pixels 1120 exhibiting substantially uniform response that arenot used in filtering calculations, and a set of pixels 1130 that areused to estimate a low pass value for the neighborhood of pixels 1110.In one embodiment, pixels 1130 may be a number of pixels divisible bytwo in order to facilitate efficient hardware or software calculations.

Referring again to FIG. 5, in blocks 571-573, additional high passfiltering and further determinations of updated NUC terms may beoptionally performed to remove spatially correlated FPN such asexhibited by pixels 1110. In block 571, the updated NUC terms determinedin block 570 are applied to the blurred image frame. Thus, at this time,the blurred image frame will have been initially corrected for spatiallycorrelated FPN (e.g., by application of the updated row and column FPNterms in block 555), and also initially corrected for spatiallyuncorrelated FPN (e.g., by application of the updated NUC terms appliedin block 571).

In block 572, a further high pass filter is applied with a larger kernelthan was used in block 565, and further updated NUC terms may bedetermined in block 573. For example, to detect the spatially correlatedFPN present in pixels 1110, the high pass filter applied in block 572may include data from a sufficiently large enough neighborhood of pixelssuch that differences can be determined between unaffected pixels (e.g.,pixels 1120) and affected pixels (e.g., pixels 1110). For example, a lowpass filter with a large kernel can be used (e.g., an N by N kernel thatis much greater than 3 by 3 pixels) and the results may be subtracted toperform appropriate high pass filtering.

In one embodiment, for computational efficiency, a sparse kernel may beused such that only a small number of neighboring pixels inside an N byN neighborhood are used. For any given high pass filter operation usingdistant neighbors (e.g., a large kernel), there is a risk of modelingactual (potentially blurred) scene information as spatially correlatedFPN. Accordingly, in one embodiment, the temporal damping factor λ maybe set close to 1 for updated NUC terms determined in block 573.

In various embodiments, blocks 571-573 may be repeated (e.g., cascaded)to iteratively perform high pass filtering with increasing kernel sizesto provide further updated NUC terms further correct for spatiallycorrelated FPN of desired neighborhood sizes. In one embodiment, thedecision to perform such iterations may be determined by whetherspatially correlated FPN has actually been removed by the updated NUCterms of the previous performance of blocks 571-573.

After blocks 571-573 are finished, a decision is made regarding whetherto apply the updated NUC terms to captured image frames (block 574). Forexample, if an average of the absolute value of the NUC terms for theentire image frame is less than a minimum threshold value, or greaterthan a maximum threshold value, the NUC terms may be deemed spurious orunlikely to provide meaningful correction. Alternatively, thresholdingcriteria may be applied to individual pixels to determine which pixelsreceive updated NUC terms. In one embodiment, the threshold values maycorrespond to differences between the newly calculated NUC terms andpreviously calculated NUC terms. In another embodiment, the thresholdvalues may be independent of previously calculated NUC terms. Othertests may be applied (e.g., spatial correlation tests) to determinewhether the NUC terms should be applied.

If the NUC terms are deemed spurious or unlikely to provide meaningfulcorrection, then the flow diagram returns to block 505. Otherwise, thenewly determined NUC terms are stored (block 575) to replace previousNUC terms (e.g., determined by a previously performed iteration of FIG.5) and applied (block 580) to captured image frames.

FIG. 8 illustrates various image processing techniques of FIG. 5 andother operations applied in an image processing pipeline 800 inaccordance with an embodiment of the disclosure. In this regard,pipeline 800 identifies various operations of FIG. 5 in the context ofan overall iterative image processing scheme for correcting image framesprovided by infrared imaging module 100. In some embodiments, pipeline800 may be provided by processing module 160 or processor 195 (both alsogenerally referred to as a processor) operating on image frames capturedby infrared sensors 132.

Image frames captured by infrared sensors 132 may be provided to a frameaverager 804 that integrates multiple image frames to provide imageframes 802 with an improved signal to noise ratio. Frame averager 804may be effectively provided by infrared sensors 132, ROIC 402, and othercomponents of infrared sensor assembly 128 that are implemented tosupport high image capture rates. For example, in one embodiment,infrared sensor assembly 128 may capture infrared image frames at aframe rate of 240 Hz (e.g., 240 images per second). In this embodiment,such a high frame rate may be implemented, for example, by operatinginfrared sensor assembly 128 at relatively low voltages (e.g.,compatible with mobile telephone voltages) and by using a relativelysmall array of infrared sensors 132 (e.g., an array of 64 by 64 infraredsensors in one embodiment).

In one embodiment, such infrared image frames may be provided frominfrared sensor assembly 128 to processing module 160 at a high framerate (e.g., 240 Hz or other frame rates). In another embodiment,infrared sensor assembly 128 may integrate over longer time periods, ormultiple time periods, to provide integrated (e.g., averaged) infraredimage frames to processing module 160 at a lower frame rate (e.g., 30Hz, 9 Hz, or other frame rates). Further information regardingimplementations that may be used to provide high image capture rates maybe found in U.S. Provisional Patent Application No. 61/495,879previously referenced herein.

Image frames 802 proceed through pipeline 800 where they are adjusted byvarious terms, temporally filtered, used to determine the variousadjustment terms, and gain compensated.

In blocks 810 and 814, factory gain terms 812 and factory offset terms816 are applied to image frames 802 to compensate for gain and offsetdifferences, respectively, between the various infrared sensors 132and/or other components of infrared imaging module 100 determined duringmanufacturing and testing.

In block 580, NUC terms 817 are applied to image frames 802 to correctfor FPN as discussed. In one embodiment, if NUC terms 817 have not yetbeen determined (e.g., before a NUC process has been initiated), thenblock 580 may not be performed or initialization values may be used forNUC terms 817 that result in no alteration to the image data (e.g.,offsets for every pixel would be equal to zero).

In blocks 818 and 822, column FPN terms 820 and row FPN terms 824,respectively, are applied to image frames 802. Column FPN terms 820 androw FPN terms 824 may be determined in accordance with block 550 asdiscussed. In one embodiment, if the column FPN terms 820 and row FPNterms 824 have not yet been determined (e.g., before a NUC process hasbeen initiated), then blocks 818 and 822 may not be performed orinitialization values may be used for the column FPN terms 820 and rowFPN terms 824 that result in no alteration to the image data (e.g.,offsets for every pixel would be equal to zero).

In block 826, temporal filtering is performed on image frames 802 inaccordance with a temporal noise reduction (TNR) process. FIG. 9illustrates a TNR process in accordance with an embodiment of thedisclosure. In FIG. 9, a presently received image frame 802 a and apreviously temporally filtered image frame 802 b are processed todetermine a new temporally filtered image frame 802 e. Image frames 802a and 802 b include local neighborhoods of pixels 803 a and 803 bcentered around pixels 805 a and 805 b, respectively. Neighborhoods 803a and 803 b correspond to the same locations within image frames 802 aand 802 b and are subsets of the total pixels in image frames 802 a and802 b. In the illustrated embodiment, neighborhoods 803 a and 803 binclude areas of 5 by 5 pixels. Other neighborhood sizes may be used inother embodiments.

Differences between corresponding pixels of neighborhoods 803 a and 803b are determined and averaged to provide an averaged delta value 805 cfor the location corresponding to pixels 805 a and 805 b. Averaged deltavalue 805 c may be used to determine weight values in block 807 to beapplied to pixels 805 a and 805 b of image frames 802 a and 802 b.

In one embodiment, as shown in graph 809, the weight values determinedin block 807 may be inversely proportional to averaged delta value 805 csuch that weight values drop rapidly towards zero when there are largedifferences between neighborhoods 803 a and 803 b. In this regard, largedifferences between neighborhoods 803 a and 803 b may indicate thatchanges have occurred within the scene (e.g., due to motion) and pixels802 a and 802 b may be appropriately weighted, in one embodiment, toavoid introducing blur across frame-to-frame scene changes. Otherassociations between weight values and averaged delta value 805 c may beused in various embodiments.

The weight values determined in block 807 may be applied to pixels 805 aand 805 b to determine a value for corresponding pixel 805 e of imageframe 802 e (block 811). In this regard, pixel 805 e may have a valuethat is a weighted average (or other combination) of pixels 805 a and805 b, depending on averaged delta value 805 c and the weight valuesdetermined in block 807.

For example, pixel 805 e of temporally filtered image frame 802 e may bea weighted sum of pixels 805 a and 805 b of image frames 802 a and 802b. If the average difference between pixels 805 a and 805 b is due tonoise, then it may be expected that the average change betweenneighborhoods 805 a and 805 b will be close to zero (e.g., correspondingto the average of uncorrelated changes). Under such circumstances, itmay be expected that the sum of the differences between neighborhoods805 a and 805 b will be close to zero. In this case, pixel 805 a ofimage frame 802 a may both be appropriately weighted so as to contributeto the value of pixel 805 e.

However, if the sum of such differences is not zero (e.g., evendiffering from zero by a small amount in one embodiment), then thechanges may be interpreted as being attributed to motion instead ofnoise. Thus, motion may be detected based on the average changeexhibited by neighborhoods 805 a and 805 b. Under these circumstances,pixel 805 a of image frame 802 a may be weighted heavily, while pixel805 b of image frame 802 b may be weighted lightly.

Other embodiments are also contemplated. For example, although averageddelta value 805 c has been described as being determined based onneighborhoods 805 a and 805 b, in other embodiments averaged delta value805 c may be determined based on any desired criteria (e.g., based onindividual pixels or other types of groups of sets of pixels).

In the above embodiments, image frame 802 a has been described as apresently received image frame and image frame 802 b has been describedas a previously temporally filtered image frame. In another embodiment,image frames 802 a and 802 b may be first and second image framescaptured by infrared imaging module 100 that have not been temporallyfiltered.

FIG. 10 illustrates further implementation details in relation to theTNR process of block 826. As shown in FIG. 10, image frames 802 a and802 b may be read into line buffers 1010 a and 1010 b, respectively, andimage frame 802 b (e.g., the previous image frame) may be stored in aframe buffer 1020 before being read into line buffer 1010 b. In oneembodiment, line buffers 1010 a-b and frame buffer 1020 may beimplemented by a block of random access memory (RAM) provided by anyappropriate component of infrared imaging module 100 and/or host device102.

Referring again to FIG. 8, image frame 802 e may be passed to anautomatic gain compensation block 828 for further processing to providea result image frame 830 that may be used by host device 102 as desired.

FIG. 8 further illustrates various operations that may be performed todetermine row and column FPN terms and NUC terms as discussed. In oneembodiment, these operations may use image frames 802 e as shown in FIG.8. Because image frames 802 e have already been temporally filtered, atleast some temporal noise may be removed and thus will not inadvertentlyaffect the determination of row and column FPN terms 824 and 820 and NUCterms 817. In another embodiment, non-temporally filtered image frames802 may be used.

In FIG. 8, blocks 510, 515, and 520 of FIG. 5 are collectivelyrepresented together. As discussed, a NUC process may be selectivelyinitiated and performed in response to various NUC process initiatingevents and based on various criteria or conditions. As also discussed,the NUC process may be performed in accordance with a motion-basedapproach (blocks 525, 535, and 540) or a defocus-based approach (block530) to provide a blurred image frame (block 545). FIG. 8 furtherillustrates various additional blocks 550, 552, 555, 560, 565, 570, 571,572, 573, and 575 previously discussed with regard to FIG. 5.

As shown in FIG. 8, row and column FPN terms 824 and 820 and NUC terms817 may be determined and applied in an iterative fashion such thatupdated terms are determined using image frames 802 to which previousterms have already been applied. As a result, the overall process ofFIG. 8 may repeatedly update and apply such terms to continuously reducethe noise in image frames 830 to be used by host device 102.

Referring again to FIG. 10, further implementation details areillustrated for various blocks of FIGS. 5 and 8 in relation to pipeline800. For example, blocks 525, 535, and 540 are shown as operating at thenormal frame rate of image frames 802 received by pipeline 800. In theembodiment shown in FIG. 10, the determination made in block 525 isrepresented as a decision diamond used to determine whether a givenimage frame 802 has sufficiently changed such that it may be consideredan image frame that will enhance the blur if added to other image framesand is therefore accumulated (block 535 is represented by an arrow inthis embodiment) and averaged (block 540).

Also in FIG. 10, the determination of column FPN terms 820 (block 550)is shown as operating at an update rate that in this example is 1/32 ofthe sensor frame rate (e.g., normal frame rate) due to the averagingperformed in block 540. Other update rates may be used in otherembodiments. Although only column FPN terms 820 are identified in FIG.10, row FPN terms 824 may be implemented in a similar fashion at thereduced frame rate.

FIG. 10 also illustrates further implementation details in relation tothe NUC determination process of block 570. In this regard, the blurredimage frame may be read to a line buffer 1030 (e.g., implemented by ablock of RAM provided by any appropriate component of infrared imagingmodule 100 and/or host device 102). The flat field correction technique700 of FIG. 7 may be performed on the blurred image frame.

In view of the present disclosure, it will be appreciated thattechniques described herein may be used to remove various types of FPN(e.g., including very high amplitude FPN) such as spatially correlatedrow and column FPN and spatially uncorrelated FPN.

Other embodiments are also contemplated. For example, in one embodiment,the rate at which row and column FPN terms and/or NUC terms are updatedcan be inversely proportional to the estimated amount of blur in theblurred image frame and/or inversely proportional to the magnitude oflocal contrast values (e.g., determined in block 560).

In various embodiments, the described techniques may provide advantagesover conventional shutter-based noise correction techniques. Forexample, by using a shutterless process, a shutter (e.g., such asshutter 105) need not be provided, thus permitting reductions in size,weight, cost, and mechanical complexity. Power and maximum voltagesupplied to, or generated by, infrared imaging module 100 may also bereduced if a shutter does not need to be mechanically operated.Reliability will be improved by removing the shutter as a potentialpoint of failure. A shutterless process also eliminates potential imageinterruption caused by the temporary blockage of the imaged scene by ashutter.

Also, by correcting for noise using intentionally blurred image framescaptured from a real world scene (not a uniform scene provided by ashutter), noise correction may be performed on image frames that haveirradiance levels similar to those of the actual scene desired to beimaged. This can improve the accuracy and effectiveness of noisecorrection terms determined in accordance with the various describedtechniques.

Referring now to FIGS. 12 to 19, various views are shown of a deviceattachment 1200 having an infrared sensor assembly 1202 in accordancewith an embodiment of the disclosure. FIG. 12 is a rear-left-bottomperspective view of device attachment 1200, and FIG. 13 is arear-left-bottom perspective view of device attachment 1200 andillustrates a user device 1250 releasably attached thereto, inaccordance with an embodiment of the disclosure.

User device 1250 may be any type of portable electronic device thatprovides all or some of the functionality of host device 102 of FIG. 1.User device 1250 may be any type of portable electronic device that maybe configured to communicate with device attachment 1200 to receiveinfrared images captured by infrared sensor assembly 1202. For example,user device 1250 may be a smart phone (e.g., iPhone™ devices from Apple,Inc., Blackberry™ devices from Research in Motion, Ltd., Android™ phonesfrom various manufacturers, or other similar mobile phones), a cellphone with some processing capability, a personal digital assistant(PDA) device, a tablet device (e.g., iPad™ from Apple, Inc., Galaxy Tab™from Samsung Electronics, Ltd., or other similar portable electronicdevices in a tablet form), a portable video game device (e.g.,PlayStation PSP™ from Sony Computer Entertainment Corp., Nintendo DS™from Nintendo, Ltd.), a portable media player (e.g., iPod Touch™ fromApple, Inc.), a laptop or portable computer, a digital camera, acamcorder, or a digital video recorder.

Device attachment 1200 may include a housing 1230 for releasablyattaching to user device 1250. In this regard, housing 1230 may comprisea tub 1232 (e.g., also referred to as a basin or recess) formed on arear surface thereof and defined by a recessed rear wall 1234, an innerwall 1236, and side walls 1238A-1238C. Tub 1232 may be shaped to atleast partially receive user device 1250, such that at least a portionof user device 1250 may be fittingly inserted into tub 1232 as shown inFIG. 13. In another embodiment, one or more of sidewalls 1238A-1238C andinner wall 1236 may be pliable and comprise cantilevered top edges thatextend toward the center of tub 1232, such that the cantilevered edgescover a portion of the front side of user device 1250 when inserted intotub 1232. In another embodiment, recessed rear wall 1234 may be hingedlyattached to housing 1230, such that recessed rear wall 1234 may belifted open to provide access to, for example, a battery compartment.

When fittingly inserted into tub 1232, user device 1250 may be securelyyet removably attached to device attachment 1200. In this regard, insome embodiments, housing 1230 may also comprise an engagement mechanism1233 (e.g., a connector plug with a latch that releasably engages aconnector receptacle or socket of user device 1250, a hook thatreleasably engages a connector receptacle of user device 1250, or otherengagement mechanisms that releasably engage any suitable part of userdevice 1250 to aids in securing user device 1250 in place) for addedsecurity, as shown in FIG. 15 illustrating a rear view of deviceattachment 1200.

In various other embodiments, the device attachment 1200 may releasablyattach to user device 1250 in any other suitable manner, instead ofreceiving user device 1250 in tub 1232 or similar structures. Forexample, the device attachment 1200 may be clipped on, clamped on, orotherwise releasably attach to one of the sides of user device 1250(e.g., the top side of user device 1250) via a clamp or similarfastening mechanism. In another example, the device attachment 1200 mayreleasably attach to user device 1250 via a connector plug comprising alatch that releasably engages a connector receptacle of device 1250.

Because access to some features of user device 1250, such as variousbuttons, switches, connectors, cameras, speakers, and microphones, maybe obstructed by housing 1230 when user device 1250 is attached, deviceattachment 1200 may comprise various replicated components and/orcutouts to allow users to access such features. For example, deviceattachment 1200 may comprise a camera cutout 1240, replicated buttons1242A-1242C, a switch cutout 1244, replicated microphone and speaker1246A-1246B, and/or replicated earphone/microphone jack 1248. Variouscomponents of device attachment 1200 may be configured to relay signalsbetween replicated components and user device 1250 (e.g., relay audiosignals from user device 1250 to replicated speaker 1246B, relay buttondepression signals from replicated buttons 1242A-1242C to user device1250). In some embodiments, cutouts and/or flexible cups (e.g., to allowusers to press the buttons underneath) may be used instead ofreplicating buttons, switches, speakers, and/or microphones.

The location, the number, and the type of replicated components and/orcutouts may be specific to user device 1250, and the various replicatedcomponents and cutouts may be implemented or not as desired forparticular applications of device attachment 1200. It will beappreciated that replicated components and/or cutouts may also beimplemented as desired in other embodiments of the device attachmentthat do not comprise tub 1232 or similar structures for attaching touser device 1250.

Device attachment 1200 may comprise infrared sensor assembly 1202disposed within housing 1230 in a main portion 1231 thereof. Mainportion 1231 may house internal components of device attachment 1200,and in one embodiment, may be placed above inner wall 1236 in the topportion of housing 1230. Infrared sensor assembly 1202 may beimplemented in the same or similar manner as infrared sensor assembly128 of FIG. 4. For example, infrared sensor assembly 1202 may include anFPA and an ROIC implemented in accordance with various embodimentsdisclosed herein. Thus, infrared sensor assembly 1202 may captureinfrared image data (e.g., thermal infrared image data) and provide suchdata from its ROIC at various frame rates.

Infrared image data captured by infrared sensor assembly 1202 may beprovided to processing module 1204 for further processing. Processingmodule 1204 may be implemented in the same or similar manner asprocessing module 160 described herein. In one embodiment, processingmodule 1204 may be electrically connected to infrared sensor assembly1202 in the various manners described herein with respect to infraredsensor assembly 128, processing module 160, and infrared imaging module100. Thus, in one embodiment, infrared sensor assembly 1202 andprocessing module 1204 may be electrically connected to each other andpackaged together to form an infrared imaging module (e.g., infraredimaging module 100) as described herein. In other embodiments, infraredsensor assembly 1202 and processing module 1204 may be electricallyand/or communicatively coupled to each other within housing 1230 inother appropriate manners, including, but not limited to, in amulti-chip module (MCM) and other small-scale printed circuit boards(PCBs) communicating via PCB traces or a bus.

Processing module 1204 may be configured to perform appropriateprocessing of captured infrared image data, and transmit raw and/orprocessed infrared image data to user device 1250. For example, whendevice attachment 1200 is attached to user device 1250, processingmodule 1204 may transmit raw and/or processed infrared image data touser device 1250 via a wired device connector or wirelessly viaappropriate wireless components further described herein. Thus, forexample, user device 1250 may be appropriately configured to receive theinfrared image data from processing module 1204 to display user-viewableinfrared images (e.g., thermograms) to users and permit users to storeinfrared image data and/or user-viewable infrared images. That is, userdevice 1250 may be configured to run appropriate software instructions(e.g., a smart phone software application, also referred to as an “app”)to function as an infrared camera that permits users to frame and takeinfrared still images, videos, or both. Device attachment 1200 and userdevice 1250 may be configured to perform other infrared imagingfunctionalities, such as storing and/or analyzing thermographic data(e.g., temperature information) contained within infrared image data.

In this regard, various infrared image processing operations may beperformed by processing module 1204, a processor of user device 1250, orboth in a coordinated manner. For example, conversion of infrared imagedata into user-viewable images may be performed by converting thethermal data (e.g., temperature data) contained in the infrared imagedata into gray-scaled or color-scaled pixels to construct images thatcan be viewed by a person. User-viewable images may optionally include alegend or scale that indicates the approximate temperature ofcorresponding pixel color and/or intensity. Such a conversion operationmay be performed by processing module 1204 before transmitting fullyconverted user-viewable images to user device 1250, by a processor ofuser device 1250 after receiving infrared image data, by processingmodule 1208 performing some steps and a processor of user device 1250performing the remaining steps, or by both processing module 1204 and aprocessor of user device 1250 in a concurrent manner (e.g., parallelprocessing). Similarly, various NUC processes described herein may beperformed by processing module 1208, a processor of user device 1250, orboth in a coordinated manner. Moreover, various other components of userdevice 1250 and device attachment 1200 may be used to perform variousNUC processes described herein. For example, if user device 1250 isequipped with motion sensors, they may be used to detect an NUC processinitiating event as described in connection with FIGS. 5 and 8.

Processing module 1204 may be configured to transmit raw and/orprocessed infrared image data to user device 1250 in response to arequest transmitted from user device 1250. For example, an app or othersoftware/hardware routines running on user device 1250 may be configuredto request transmission of infrared image data when the app is launchedand ready to display user-viewable images on a display for users toframe and take infrared still or video shots. Processing module 1204 mayinitiate transmission of infrared image data captured by infrared sensorassembly 1202 when the request from the app on user device 1250 isreceived via wired connection (e.g., through a device connector) orwireless connection. In another embodiment, an app or othersoftware/hardware routines on user device 1250 may request infraredimage data when a user takes a still and/or video shot, but usevisible-light image data captured by a visible-light camera that may bepresent on user device 1250 to present images for framing before theuser takes a shot. In yet another embodiment, an app or othersoftware/hardware routines may use infrared image data to present imagesfor framing, but permit users to take visible-light still and/or videoshots (e.g., to allow framing of visible light flash photography in alow or no light condition).

Device attachment 1200 may include a programmable button 1249 disposedat an accessible location (e.g., on the top side surface) of housing1230. Programmable button 1249 may be used, for example, by an app orother software/hardware routines on user device 1250 to provide ashortcut to a specific function or functions as desired for the app,such as to launch the app for infrared imaging or as a “shutter button”that users can press to take a still or video shot. Processing module1204 may be configured to detect a depression of programmable button1249, and relay the detected button depression to user device 1250.

Device attachment 1200 may include a lens assembly 1205 disposed, forexample, on a front side surface 1237 of housing 1230 in main portion1231. In other embodiments, lens assembly 1205 may be disposed onhousing 1230 at any other location suitable for providing an aperturefor infrared radiation to reach infrared sensor array 1202. Lensassembly 1205 may comprise a lens 1206 that may be made from appropriatematerials (e.g., polymers or infrared transmitting materials such assilicon, germanium, zinc selenide, or chalcogenide glasses) andconfigured to pass infrared radiation through to infrared sensorassembly. Lens assembly 1205 may also comprise a shutter 1207implemented in the same or similar manner as shutter 105 of host device102. In some embodiments, lens assembly 1205 may include other opticalelements, such as infrared-transmissive prisms, infrared-reflectivemirrors, and infrared filters, as desired for various applications ofdevice attachment 1200. For example, lens assembly 1205 may include oneor more filters adapted to pass infrared radiation of certainwavelengths but substantially block off others (e.g., short-waveinfrared (SWIR) filters, mid-wave infrared (MWIR) filters, long-waveinfrared (LWIR) filters, and narrow-band filters). Such filters may beutilized to tailor infrared sensor assembly 1202 for increasedsensitivity to a desired band of infrared wavelengths.

Device attachment 1200 may also include a battery 1208 disposed, forexample, within housing 1230 between recessed rear wall 1234 and a frontside surface 1237. In other embodiments, battery 1208 may be disposed atany other suitable location, including main portion 1231 of housing1230, that provides room for housing battery 1208. Battery 1208 may beconfigured to be used as a power source for internal components (e.g.,infrared sensor assembly 1202, processing module 1204) of deviceattachment 1200, so that device attachment 1200 does not drain thebattery of user device 1250 when attached. Further, battery 1208 may beconfigured to provide electrical power to user device 1250, for example,through a device connector. Thus, battery 1208 may beneficially providea backup power for user device 1250 to run and charge from. Conversely,various components of device attachment 1200 may be configured to useelectrical power from the battery of user device 1200 (e.g., through adevice connector), if a user desires to use functionalities of deviceattachment 1200 even when battery 1208 is drained.

Battery 1208 may be implemented as a rechargeable battery using asuitable technology (e.g., nickel cadmium (NiCd), nickel metal hydride(NiMH), lithium ion (Li-ion), or lithium ion polymer (LiPo) rechargeablebatteries). In this regard, device attachment 1200 may include a powersocket 1241 for connecting to (e.g., through a cable or wire) andreceiving electrical power from an external power source (e.g., AC poweroutlet, DC power adapter, or other similar appropriate power sources)for charging battery 1208 and/or powering internal components of deviceattachment 1200.

In some embodiments, device attachment 1200 may also accept standardsize batteries that are widely available and can be obtainedconveniently when batteries run out, so that users can keep using deviceattachment 1200 and/or user device 1250 by simply purchasing andinstalling standard batteries even when users do not have an appropriatebattery charger or DC power adapter at hand. As described above,recessed inner wall 1234 or other part of housing 1230 may be hingedand/or removable to remove/install batteries.

As described above, device attachment 1200 may include a deviceconnector (e.g., implemented in some embodiments in the same or similarmanner as device connector plug 2052 of FIG. 21 further describedherein) that carries various signals and electrical power to and fromuser device 1250 when attached. The device connector may be disposed ata location that is suitably aligned with the corresponding deviceconnector receptacle or socket of user device 1250, so that the deviceconnector can engage the corresponding device connector receptacle orsocket of user device 1250 when device attachment 1200 is attached touser device 1250. For example, if user device 1250 is equipped with aconnector receptacle on its bottom side surface, the device connectormay be positioned at an appropriate location on side wall 1238C. Asdescribed in connection with engagement mechanism 1233, the deviceconnector may also include a mechanical fixture (e.g., a locking/latchedconnector plug) used to support and/or align user device.

The device connector may be implemented according to the connectorspecification associated with the type of user device 1250. For example,the device connector may implement a proprietary connector (e.g., anApple® dock connector for iPod™ and iPhone™ such as a “Lightning”connector, a 30-pin connector, or others) or a standardized connector(e.g., various versions of Universal Serial Bus (USB) connectors,Portable Digital Media Interface (PDMI), or other standard connectors asprovided in user devices).

In one embodiment, the device connector may be interchangeably provided,so that device attachment 1200 may accommodate different types of userdevices that accept different device connectors. For example, varioustypes of device connector plugs may be provided and configured to beattached to a base connector on housing 1230, so that a connector plugthat is compatible with user device 1250 can be attached to the baseconnector before attaching device attachment 1200 to user device 1250.In another embodiment, the device connector may be fixedly provided.

In some embodiments, another device connector may be implemented onhousing 1230 to provide a connection to other external devices. Forexample, power socket 1241 may also serve as a connector that enablescommunication to and from (e.g., via an appropriate cable or wire) anexternal device such as a desktop computer or other devices not attachedto device attachment 1200, thus allowing device attachment 1250 to beused as an infrared imaging accessory for an external device as well.Also, if desired, power socket 1241 may be used to connect to userdevice 1250 as an alternative way of connecting device attachment touser device 1250.

Device attachment 1200 may also communicate with user device 1250 via awireless connection. In this regard, device attachment 1200 may includea wireless communication module 1209 configured to facilitate wirelesscommunication between user device 1250 and processing module 1204 orother components of device attachment 1200. In various embodiments,wireless communication module 1209 may support the IEEE 802.11 WiFistandards, the Bluetooth™ standard, the ZigBee™ standard, or otherappropriate short range wireless communication standards. Thus, deviceattachment 1200 may be used with user device 1250 without relying on thedevice connector, if a connection through the device connector is notavailable or not desired.

In some embodiments, wireless communication module 1209 may beconfigured to manage wireless communication between processing module1204 and other external devices, such as a desktop computer, thusallowing device attachment 1250 to be used as an infrared imagingaccessory for an external device as well.

Device attachment 1250 may further include, in some embodiments, coolingfins 1247 configured to provide a more efficient cooling of internalcomponents. Cooling fins 1247 may be positioned on an exterior sidesurface (e.g., the top side surface) of housing 1230 near internalcomponents, and comprise a plurality of fins or blades to increase thesurface area in contact with air.

In various embodiments, device attachment 1250 may also include variousother components that may be implemented in host device 102 of FIG. 1,but may be missing in a particular type of user device that deviceattachment 1250 may be used with. For example, motion sensors may beimplemented in device attachment 1250 in the same or similar manner asmotion sensors 194 of host device 102, if motion sensors are notimplemented in user device 1250. Motion sensors may be utilized byprocessing module 1204, a processor of user device 1250, or both, inperforming an NUC operation as described herein.

FIGS. 20-22 show various views of a device attachment 2000 according toanother embodiment of the disclosure. Device attachment 2000 may includea housing 2030 with a tub 2032 (e.g., also referred to as a basin orrecess) shaped to at least partially receive a user device 2050, a lensassembly 2005, a camera cutout 2040, a power socket 2041, replicatedbuttons 2042A-2042C, a switch cutout 2044, cooling fins 2047 (e.g., heatsink and cooling fins), and replicated earphone/microphone jack 2048,any one of which may be implemented in the same or similar manner as thecorresponding components of device attachment 1200 of FIGS. 12-19,except for some dissimilarities in locations and shapes of somecomponents as can be seen from FIGS. 20-22. Device attachment 2000 mayinclude various internal components, such as an infrared sensorassembly, a processing module, and a wireless communication module,disposed within housing 2030. Any one of such internal components may beimplemented in the same or similar manner as the correspondingcomponents of device attachment 1200.

In this example, a fixed device connector plug 2052 may implement thedevice connector of device attachment 2000, and may provide someadditional support when user device 2050 is releasably yet securelyinserted into tub 2032. This example also shows a protective cover 2054,which may protectively enclose at least some of the internal componentsof device attachment 2000. Protective cover 2054 may comprise atranslucent logo and a light source (e.g., LED light) for illuminatingthe translucent logo. In this regard, cooling fins 2047 may be furtherconfigured to form part of or coupled to a heat sink to provide a moreefficient cooling of the light source in addition to cooling theinternal components (e.g., electronics and light source to illuminatethe logo and/or electronics associated with the infrared sensor assemblyor infrared sensor of device attachment 2000).

Therefore, various embodiments of device attachment 1200/2000 mayreleasably attach to various conventional electronic devices, andbeneficially provide infrared imaging capabilities to such conventionalelectronic devices. With device attachment 1200/2000 attached, mobilephones and other conventional electronic devices already in widespreaduse may be utilized for various advantageous applications of infraredimaging.

In some embodiments, infrared image data such as thermal images capturedusing device attachment 1200/2000 may be combined with non-thermal imagedata (e.g., visible light images such as red images, blue images, greenimages, near-infrared images, etc.). In one embodiment, the non-thermalimage data may be captured by a visible-light camera that may be presenton a mobile phone or other conventional electronic device that isreleasably attached to device attachment 1200/2000. In anotherembodiment, the non-thermal image data may be captured by avisible-light camera that may be present on device attachment 1200/2000.

FIG. 23 shows an example of a process in which thermal and non-thermalimages are combined. As shown in FIG. 23, an infrared imager such asinfrared imaging module 6000 may be used to capture one or more thermalimages 6007. Infrared imaging module 6000 may, for example, be animplementation of infrared imaging module 100 of device attachment1200/2000.

A non-thermal camera module such as non-thermal camera module 6002 maybe used to capture non-thermal images 6006. Non-thermal camera module6002 may be implemented as a small form factor non-thermal imagingmodule or imaging device having one or more sensors responsive tonon-thermal radiation (e.g., radiation in the visible, near infrared,short-wave infrared or other non-thermal portion of the electromagneticspectrum). For example, in some embodiments, camera module 6002 may beimplemented with a charge-coupled device (CCD) sensor, an electronmultiplying CCD (EMCCD) sensor, a complementarymetal-oxide-semiconductor (CMOS) sensor, a scientific CMOS (sCMOS)sensor, an intensified charge-coupled device (ICCD), or other sensors.As described in further detail below, non-thermal camera module 6002 maybe a component of a user device such as device 1250 or may be acomponent of device attachment 1200/2000.

As shown in FIG. 23, one or more thermal images 6007 and one or morenon-thermal images 6006 may be provided to a processor such as processor6004. In various embodiments, processor 6004 may be a processorassociated with device attachment 1200/2000 (e.g., processing module1204), a processor associated with device 1250, or processor 6004 mayrepresent the combined processing capabilities of device 1250 and deviceattachment 1200/2000.

Processor 6004 may fuse, superimpose, or otherwise combine non-thermalimages 6006 with thermal images 6007 as further described herein to formprocessed images 6008. Processed images 6008 may be provided to adisplay of device 1250, stored in memory of device 1250 or deviceattachment 1200, or transmitted to external equipment (as examples).

FIGS. 24, 25, and 26 show various exemplary embodiments for device 1250and a releasably attached device component such as device attachment1200 (identified only for purposes of example; any of device attachments1200, 1201, 1203, 2000, or others may be used interchangeably in any ofthe embodiments described herein where appropriate) that may be usedwhen it is desired to capture and combine non-thermal and thermalimages.

In the embodiment shown in FIG. 24, non-thermal camera module 6002 isimplemented as a component of device 1250. In this embodiment,non-thermal images 6006 are captured using non-thermal camera module6002 of device 1250 and provided to device processor 6102. Thermalimages 6007 are captured using infrared imaging module 1202 of deviceattachment 1200 and are also provided to device processor 6102wirelessly or through device connector 6020 (e.g., a device connector ofthe type described above in connection with FIGS. 12-19) and a matingconnector 6104 on device 1250. Mating connector 6104 may be aproprietary connector, a standardized connector such as a UniversalSerial Bus (USB) connector or a Portable Digital Media Interface (PDMI),or other standard connectors as provided in user devices. If desired,thermal images 6007 may undergo some processing using processing module1204 before being provided to device processor 6102.

In the embodiment shown in FIG. 25, non-thermal images 6006 are capturedusing non-thermal camera module 6002 of device 1250 and provided todevice attachment processor 1204 wirelessly or through connectors 6104and 6020. In this embodiment, thermal images 6007 are also provided toprocessor 1204 from infrared imaging module 1202 to be combined withnon-thermal images 6006 to form processed images 6008. If desired,non-thermal images 6006 may undergo some processing using processor 6102before being provided to device attachment processor 1204. In thisembodiment, processed images 6008 may be provided back to processor 6102to be stored, displayed, or otherwise handled by processor 6102.

In the embodiment shown in FIG. 26, non-thermal camera module 6002 isimplemented as a component of device attachment 1200. In thisembodiment, both non-thermal images 6006 and thermal images 6007 arecaptured using imaging sensors in device attachment 1200. In thisembodiment, non-thermal images 6006 are captured using non-thermalimaging module 6002 of device attachment 1200, thermal images 6007 arecaptured using infrared imaging module 1202, and both thermal images6007 and non-thermal images 6006 are provided to device attachmentprocessor 1204 to be combined to form processed images 6008. Non-thermalimages 6006 and thermal images 6007 may be partially or completelycombined as desired by device attachment processor 1204 before beingprovided to device processor 6102, unprocessed non-thermal images 6006and thermal images 6007 may be provided to device processor 6102 forprocessing and combining, or image processing operations for non-thermalimages 6006 and thermal images 6007 may be shared by processors 1204 and6102.

FIG. 27 illustrates a process 6200 for capturing and combining thermaland non-thermal images using a device and a device attachment.

At block 6202, thermal and non-thermal images may be captured. Thermalimages may be captured using an infrared imaging sensor in a deviceattachment attached to a device. Non-thermal images may be capturedusing a non-thermal camera module in the device (see, e.g., FIGS. 24 and25) or in the device attachment (see, e.g., FIG. 26).

At block 6204, the thermal and non-thermal images captured at block 6202may be processed. The thermal and non-thermal images may undergoindividual processing operations and/or processing operations forcombining, fusing, or superimposing the images. Processing the thermaland non-thermal images may include parallax corrections based on thedistance between the non-thermal camera module and the infrared imagingsensor used to capture the images. The thermal and non-thermal imagesmay be processed using a processor in the device (see, e.g., FIGS. 24,and 26) and/or using a processor in the device attachment (see, e.g.,FIG. 25) to form processed (e.g., combined, fused, or superimpose)images as further described herein, for example, with reference to FIGS.35 and 36. Processing the thermal images may also include performingvarious image correction operations such as a NUC process as describedherein.

At block 6206, suitable action may be taken with the processed images.Suitable action may include displaying the processed images (e.g., usinga display of the device), storing the processed images (e.g., on thedevice and/or on the device attachment), and/or transmitting theprocessed images (e.g., between the device and the device attachment, orto external equipment).

FIGS. 28-29 and 30-31 are perspective views of other device attachments1201 and 1203, respectively, configured to receive various types of userdevices. In the embodiments shown in FIGS. 28-29 and 30-31, deviceattachments 1201 and 1203 may also include both thermal and non-thermalimaging components, and may be implemented in accordance with any of thevarious features of device attachments 1200 and 2000 described herein.

In the embodiment of FIG. 28, a rear perspective view of a deviceattachment having a shape for receiving devices from Apple, Inc.® (e.g.,iPhone™ devices, iPad™ devices, or iPod Touch™ devices) is shown. Asshown in FIG. 28, device attachment 1200 may include a camera window1243 through which the device camera (e.g., a non-thermal camera modulesuch as a visible light camera module of the device) can capture images,and a plurality of imaging components such as infrared sensor 7000 andnon-thermal camera module 7002. If desired, device attachment 1201 mayalso include a mechanical shutter such as user operable shutter 7004.User operable shutter 7004 may be moved by a user of device attachment1200 to selectively block or unblock imaging components 7000 and/or7002. In some embodiments, user operable shutter 7004 may also power offor on device attachment 1200 when moved to block or unblock imagingcomponents 7000 and 7002. In some embodiments, user operable shutter7004 may be used, for example, to protect imaging components 7000 and7002 when not in use. Shutter 7004 may also be used as a temperaturereference as part of a calibration process (e.g., a NUC process,radiometric calibration process, or other calibration processes) forinfrared sensor 7000 as would be understood by one skilled in the art.

Infrared sensor 7000 may include an infrared imaging module such asinfrared imaging module 100 and other suitable components of an infraredsensor (e.g., lenses, filters, and/or windows) as described herein.Infrared sensor 7000 and non-thermal camera module 7002 may be used togenerate respective infrared (e.g., thermal) and non-thermal images tobe used separately or in combination as described in connection withFIGS. 23, 26, and 27 and/or other image combination processes describedhereinafter. For example, infrared sensor 7000 may be an implementationof infrared imaging module 1202 and non-thermal camera module 7002 maybe an implementation of non-thermal camera module 6002 (see, e.g., FIG.26).

As shown in FIG. 28, device attachment 1250 may include a front portion7007 and a rear portion 7009. Front portion 7007 may be formed from ahousing that encloses functional components of the device attachmentsuch as a battery, connectors, imaging components, processors, memory,communications components, and/or other components of a deviceattachment as described herein. Rear portion 7009 may be a structuralhousing portion having a shape that forms a recess into which a userdevice can be releasably attached.

FIG. 29 is a front perspective view of the device attachment of FIG. 28showing how a user device 1250 from Apple, Inc.® may be releasablyattached to device attachment 1201 (e.g., by inserting the device into arecess in a housing portion for the device attachment formed from a rearwall and at least one sidewall that at least partially surround thedevice).

In the embodiment of FIG. 30, a rear perspective view of a deviceattachment 1203 having a shape for receiving devices from SamsungElectronics, Ltd.® (e.g., Galaxy Tab™ devices, Galaxy S™ devices, GalaxyNote™ devices, other Galaxy™ devices, or other devices from Samsung). Asshown in FIG. 30, device attachment 1203 may include a camera window1245 through which the device camera (e.g., a non-thermal camera modulesuch as a visible light camera module in the device) can capture images,and a plurality of imaging components such as infrared sensor 7001 andnon-thermal camera module 7003. If desired, device attachment 1200 mayalso include a mechanical shutter such as user operable shutter 7005.User operable shutter 7005 may be moved by a user of device attachment1203 to selectively block or unblock imaging components 7001 and 7003.In some embodiments, user operable shutter 7005 may power off or ondevice attachment 1203 when moved to block or unblock imaging components7001 and 7003. In this type of arrangement, device attachment 1203 mayalso include an attachment member such as engagement member 7006configured to extend around a portion of a user device to securely andreleasably attach the device attachment 1203 to the user device. In oneembodiment, non-thermal camera module 7003 may be omitted and shutter7005 may include an extended portion in the location at whichnon-thermal camera module 7003 is shown that slides over infrared sensor7001 when a user moves shutter 7005.

FIG. 31 is a front perspective view of the device attachment 1203 ofFIG. 30 showing how a user device 1251 from Samsung Electronics, Ltd.®may be releasably attached to device attachment 1203 (e.g., by insertingthe user device 1251 into a recess in a housing for the deviceattachment 1203 formed from a rear wall, at least one sidewall, and anattachment member 7006 that at least partially surround the device).

As shown in FIGS. 29 and 31 (as examples), device attachments 1201/1203may be arranged so that a display of the user device 1250/1251 remainsvisible and accessible to the user when device attachment 1201/1203 isattached to the device.

The examples of FIGS. 28, 29, 30, and 31 are merely illustrative. Ifdesired, attachment device 1200 may be configured to have a size andshape suitable for receiving a user device from any manufacturer.

Various embodiments in which non-thermal images are combined withthermal images as described above in connection with, for example, FIGS.23-27 are discussed herein in further detail in, for example, FIGS.34-39. The examples discussed in connection with FIGS. 34-39 describecombining or fusing thermal images with visible light images, however,it should be appreciated that the devices, processes and techniquesdescribed may be applied for combining or fusing any suitable thermaland non-thermal images.

Before discussing various embodiments in which non-thermal cameramodules are used to generate non-thermal images for combination orfusion with thermal images, FIGS. 32 and 33 describe a low powerimplementation for an infrared imaging module.

As discussed, in various embodiments, infrared imaging module 100 may beconfigured to operate at low voltage levels. In particular, infraredimaging module 100 may be implemented with circuitry configured tooperate at low power and/or in accordance with other parameters thatpermit infrared imaging module 100 to be conveniently and effectivelyimplemented in various types of host devices 102, such as mobile devicesand other devices.

For example, FIG. 32 illustrates a block diagram of anotherimplementation of infrared sensor assembly 128 including infraredsensors 132 and an LDO 8220 in accordance with an embodiment of thedisclosure. As shown, FIG. 32 also illustrates various components 8202,8204, 8205, 8206, 8208, and 8210 which may implemented in the same orsimilar manner as corresponding components previously described withregard to FIG. 4. FIG. 32 also illustrates bias correction circuitry8212 which may be used to adjust one or more bias voltages provided toinfrared sensors 132 (e.g., to compensate for temperature changes,self-heating, and/or other factors).

In some embodiments, LDO 8220 may be provided as part of infrared sensorassembly 128 (e.g., on the same chip and/or wafer level package as theROIC). For example, LDO 8220 may be provided as part of an FPA withinfrared sensor assembly 128. As discussed, such implementations mayreduce power supply noise introduced to infrared sensor assembly 128 andthus provide an improved PSRR. In addition, by implementing the LDO withthe ROIC, less die area may be consumed and fewer discrete die (orchips) are needed.

LDO 8220 receives an input voltage provided by a power source 8230 overa supply line 8232. LDO 8220 provides an output voltage to variouscomponents of infrared sensor assembly 128 over supply lines 8222. Inthis regard, LDO 8220 may provide substantially identical regulatedoutput voltages to various components of infrared sensor assembly 128 inresponse to a single input voltage received from power source 8230.

For example, in some embodiments, power source 8230 may provide an inputvoltage in a range of approximately 2.8 volts to approximately 11 volts(e.g., approximately 2.8 volts in one embodiment), and LDO 8220 mayprovide an output voltage in a range of approximately 1.5 volts toapproximately 2.8 volts (e.g., approximately 2.5 volts in oneembodiment). In this regard, LDO 8220 may be used to provide aconsistent regulated output voltage, regardless of whether power source8230 is implemented with a conventional voltage range of approximately 9volts to approximately 11 volts, or a low voltage such as approximately2.8 volts. As such, although various voltage ranges are provided for theinput and output voltages, it is contemplated that the output voltage ofLDO 8220 will remain fixed despite changes in the input voltage.

By regulating a single power source 8230 by LDO 8220, appropriatevoltages may be separately provided (e.g., to reduce possible noise) toall components of infrared sensor assembly 128 with reduced complexity.The use of LDO 8220 also allows infrared sensor assembly 128 to operatein a consistent manner, even if the input voltage from power source 8230changes (e.g., if the input voltage increases or decreases as a resultof charging or discharging a battery or other type of device used forpower source 8230).

LDO 8220 may be implemented to provide a low voltage (e.g.,approximately 2.5 volts). This contrasts with the multiple highervoltages typically used to power conventional FPAs, such as:approximately 3.3 volts to approximately 5 volts used to power digitalcircuitry; approximately 3.3 volts used to power analog circuitry; andapproximately 9 volts to approximately 11 volts used to power loads.Also, in some embodiments, the use of LDO 8220 may reduce or eliminatethe need for a separate negative reference voltage to be provided toinfrared sensor assembly 128.

Additional aspects of the low voltage operation of infrared sensorassembly 128 may be further understood with reference to FIG. 33. FIG.33 illustrates a circuit diagram of a portion of infrared sensorassembly 128 of FIG. 32 in accordance with an embodiment of thedisclosure. In particular, FIG. 33 illustrates additional components ofbias correction circuitry 8212 (e.g., components 9326, 9330, 9332, 9334,9336, 9338, and 9341) connected to LDO 8220 and infrared sensors 132.For example, bias correction circuitry 8212 may be used to compensatefor temperature-dependent changes in bias voltages in accordance with anembodiment of the present disclosure. The operation of such additionalcomponents may be further understood with reference to similarcomponents identified in U.S. Pat. No. 7,679,048 issued Mar. 16, 2010which is hereby incorporated by reference in its entirety. Infraredsensor assembly 128 may also be implemented in accordance with thevarious components identified in U.S. Pat. No. 6,812,465 issued Nov. 2,2004 which is hereby incorporated by reference in its entirety.

In various embodiments, some or all of the bias correction circuitry8212 may be implemented on a global array basis as shown in FIG. 33(e.g., used for all infrared sensors 132 collectively in an array). Inother embodiments, some or all of the bias correction circuitry 8212 maybe implemented an individual sensor basis (e.g., entirely or partiallyduplicated for each infrared sensor 132). In some embodiments, biascorrection circuitry 8212 and other components of FIG. 33 may beimplemented as part of ROIC 8202.

As shown in FIG. 33, LDO 8220 provides a load voltage Vload to biascorrection circuitry 8212 along one of supply lines 8222. As discussed,in some embodiments, Vload may be approximately 2.5 volts whichcontrasts with larger voltages of approximately 9 volts to approximately11 volts that may be used as load voltages in conventional infraredimaging devices.

Based on Vload, bias correction circuitry 8212 provides a sensor biasvoltage Vbolo at a node 9360. Vbolo may be distributed to one or moreinfrared sensors 132 through appropriate switching circuitry 9370 (e.g.,represented by broken lines in FIG. 33). In some examples, switchingcircuitry 9370 may be implemented in accordance with appropriatecomponents identified in U.S. Pat. Nos. 6,812,465 and 7,679,048previously referenced herein.

Each infrared sensor 132 includes a node 9350 which receives Vbolothrough switching circuitry 9370, and another node 9352 which may beconnected to ground, a substrate, and/or a negative reference voltage.In some embodiments, the voltage at node 9360 may be substantially thesame as Vbolo provided at nodes 9350. In other embodiments, the voltageat node 9360 may be adjusted to compensate for possible voltage dropsassociated with switching circuitry 9370 and/or other factors.

Vbolo may be implemented with lower voltages than are typically used forconventional infrared sensor biasing. In one embodiment, Vbolo may be ina range of approximately 0.2 volts to approximately 0.7 volts. Inanother embodiment, Vbolo may be in a range of approximately 0.4 voltsto approximately 0.6 volts. In another embodiment, Vbolo may beapproximately 0.5 volts. In contrast, conventional infrared sensorstypically use bias voltages of approximately 1 volt.

The use of a lower bias voltage for infrared sensors 132 in accordancewith the present disclosure permits infrared sensor assembly 128 toexhibit significantly reduced power consumption in comparison withconventional infrared imaging devices. In particular, the powerconsumption of each infrared sensor 132 is reduced by the square of thebias voltage. As a result, a reduction from, for example, 1.0 volt to0.5 volts provides a significant reduction in power, especially whenapplied to many infrared sensors 132 in an infrared sensor array. Thisreduction in power may also result in reduced self-heating of infraredsensor assembly 128.

In accordance with additional embodiments of the present disclosure,various techniques are provided for reducing the effects of noise inimage frames provided by infrared imaging devices operating at lowvoltages.

For example, referring to FIG. 33, when LDO 8220 maintains Vload at alow voltage in the manner described herein, Vbolo will also bemaintained at its corresponding low voltage and the relative size of itsoutput signals may be reduced. As a result, noise, self-heating, and/orother phenomena may have a greater effect on the smaller output signalsread out from infrared sensors 132, resulting in variations (e.g.,errors) in the output signals.

To compensate for such phenomena, infrared sensor assembly 128, infraredimaging module 100, and/or host device 102 may be implemented withvarious array sizes, frame rates, and/or frame averaging techniques. Forexample, as discussed, a variety of different array sizes arecontemplated for infrared sensors 132. In some embodiments, infraredsensors 132 may be implemented with array sizes ranging from 32 by 32 to160 by 120 infrared sensors 132. Other example array sizes include 80 by64, 80 by 60, 64 by 64, and 64 by 32. Any desired array size may beused.

Advantageously, when implemented with such relatively small array sizes,infrared sensor assembly 128 may provide image frames at relatively highframe rates without requiring significant changes to ROIC and relatedcircuitry. For example, in some embodiments, frame rates may range fromapproximately 120 Hz to approximately 480 Hz.

In some embodiments, the array size and the frame rate may be scaledrelative to each other (e.g., in an inversely proportional manner orotherwise) such that larger arrays are implemented with lower framerates, and smaller arrays are implemented with higher frame rates. Forexample, in one embodiment, an array of 160 by 120 may provide a framerate of approximately 120 Hz. In another embodiment, an array of 80 by60 may provide a correspondingly higher frame rate of approximately 240Hz. Other frame rates are also contemplated.

By scaling the array size and the frame rate relative to each other, theparticular readout timing of rows and/or columns of the FPA may remainconsistent, regardless of the actual FPA size or frame rate. In oneembodiment, the readout timing may be approximately 63 microseconds perrow or column.

As previously discussed with regard to FIG. 8, the image frames capturedby infrared sensors 132 may be provided to a frame averager 804 thatintegrates multiple image frames to provide image frames 802 (e.g.,processed image frames) with a lower frame rate (e.g., approximately 30Hz, approximately 60 Hz, or other frame rates) and with an improvedsignal to noise ratio. In particular, by averaging the high frame rateimage frames provided by a relatively small FPA, image noiseattributable to low voltage operation may be effectively averaged outand/or substantially reduced in image frames 802. Accordingly, infraredsensor assembly 128 may be operated at relatively low voltages providedby LDO 8220 as discussed without experiencing additional noise andrelated side effects in the resulting image frames 802 after processingby frame averager 804.

Although a single array of infrared sensors 132 is illustrated, it iscontemplated that multiple such arrays may be used together to providehigher resolution image frames (e.g., a scene may be imaged acrossmultiple such arrays). Such arrays may be provided in multiple infraredsensor assemblies 128 and/or provided in the same infrared sensorassembly 128. Each such array may be operated at low voltages asdescribed, and also may be provided with associated ROIC circuitry suchthat each array may still be operated at a relatively high frame rate.The high frame rate image frames provided by such arrays may be averagedby shared or dedicated frame averagers 804 to reduce and/or eliminatenoise associated with low voltage operation. As a result, highresolution infrared images may be obtained while still operating at lowvoltages.

In various embodiments, infrared sensor assembly 128 may be implementedwith appropriate dimensions to permit infrared imaging module 100 to beused with a small form factor socket 104, such as a socket used formobile devices. For example, in some embodiments, infrared sensorassembly 128 may be implemented with a chip size in a range ofapproximately 4.0 mm by approximately 4.0 mm to approximately 5.5 mm byapproximately 5.5 mm (e.g., approximately 4.0 mm by approximately 5.5 mmin one example). Infrared sensor assembly 128 may be implemented withsuch sizes or other appropriate sizes to permit use with socket 104implemented with various sizes such as: 8.5 mm by 8.5 mm, 8.5 mm by 5.9mm, 6.0 mm by 6.0 mm, 5.5 mm by 5.5 mm, 4.5 mm by 4.5 mm, and/or othersocket sizes such as, for example, those identified in Table 1 of U.S.Provisional Patent Application No. 61/495,873 previously referencedherein.

In some embodiments, such as those described above in connection with,for example, FIGS. 23-27, infrared imaging modules 100 may be configuredto produce infrared images that can be combined with non-thermal imagessuch as visible spectrum images produce high resolution, high contrast,and/or targeted contrast combined images of a scene, for example, thatinclude highly accurate radiometric data (e.g., infrared information)corresponding to one or more objects in the scene.

Referring now to FIG. 34, FIG. 34 shows a block diagram of imagingsystem 4000 adapted to image scene 4030 in accordance with an embodimentof the disclosure. For example, system 4000 may represent a combinationof any of the user devices and any of the device attachments describedherein. System 4000 may include one or more imaging modules, such asvisible spectrum imaging module 4002 a and infrared imaging module 4002b (which may respectively represent any of the non-thermal cameramodules and infrared imaging modules described herein, or combinationsthereof, for example), processor 4010 (which may represent any of theprocessors described herein, or combinations thereof, for example),memory 4012 (e.g., one or more memory devices provided in any of theuser devices and/or device attachments described herein and implementedin a similar manner as memory 196 of host device 102, for example), acommunication module 4014, a display 4016, and other components 4018.Where appropriate, elements of system 4000 may be implemented in thesame or similar manner as other devices and systems described herein andmay be configured to perform various NUC processes and other processesas described herein.

For example, system 4000 may form a portion of a device attachment 1200.For example, visible spectrum imaging module 4002 a may be animplementation of a non-thermal camera module and/or infrared imagingmodule 4002 b may be an implementation of an infrared sensor. Althoughsystem 4000 is described as including visible spectrum imaging module4002 a, it should be appreciated that visible spectrum imaging module4002 a may be substituted with any suitable non-thermal camera module.As such, descriptions of combining visible spectrum images with thermalimages herein may be similarly applied to combining thermal images withnon-thermal images other than visible spectrum images (e.g.,near-infrared images, short-wave infrared images, etc.).

As shown in FIG. 34, scene 4030 (e.g., illustrated as a top plan view)may include various predominately stationary elements, such as building4032, windows 4034, and sidewalk 4036, and may also include variouspredominately transitory elements, such as vehicle 4040, cart 4042, andpedestrians 4050. Building 4032, windows 4034, sidewalk 4036, vehicle4040, cart 4042, and pedestrians 4050 may be imaged by visible spectrumimaging module 4002 a, for example, whenever scene 4030 is visiblyilluminated by ambient light (e.g., daylight) or by an artificialvisible spectrum light source, for example, as long as those elements ofscene 4030 are not otherwise obscured by smoke, fog, or otherenvironmental conditions. Building 4032, windows 4034, sidewalk 4036,vehicle 4040, cart 4042, and pedestrians 4050 may be imaged by infraredimaging module 4002 b to provide real-time imaging and/or low-lightimaging of scene 4030 when scene 4030 is not visibly illuminated (e.g.,by visible spectrum light), for example.

In some embodiments, imaging system 4000 can be configured to combinevisible spectrum images from visible spectrum imaging module 4002 acaptured at a first time (e.g., when scene 4030 is visibly illuminated),for example, with infrared images from infrared imaging module 4002 bcaptured at a second time (e.g., when scene 4030 is not visiblyilluminated), for instance, in order to generate combined imagesincluding radiometric data and/or other infrared characteristicscorresponding to scene 4030 but with significantly more object detailand/or contrast than typically provided by the infrared or visiblespectrum images alone. In other embodiments, the combined images caninclude radiometric data corresponding to one or more objects withinscene 4030, for example, and visible spectrum characteristics, such as avisible spectrum color of the objects (e.g., for predominantlystationary objects), for example. In some embodiments, both the infraredimages and the combined images can be substantially real time images orvideo of scene 4030. In other embodiments, combined images of scene 4030can be generated substantially later in time than when correspondinginfrared and/or visible spectrum images have been captured, for example,using stored infrared and/or visible spectrum images and/or video. Instill further embodiments, combined images may include visible spectrumimages of scene 4030 captured before or after corresponding infraredimages have been captured.

In each embodiment, visible spectrum images including elements of scene4030 such as building 4032, windows 4034, and sidewalk 4036, can beprocessed to provide visible spectrum characteristics that, whencombined with infrared images, allow easier recognition and/orinterpretation of the combined images.

In various embodiments, one or more components of system 4000 may becombined and/or implemented or not, depending on applicationrequirements. For example, processor 4010 may be combined with any ofimaging modules 4002 a-b, memory 4012, display 4016, and/orcommunication module 4014. In another example, processor 4010 may becombined with any of imaging modules 4002 a-b with only certainoperations of processor 4010 performed by circuitry (e.g., a processor,logic device, microprocessor, microcontroller, etc.) within any of theinfrared imaging modules.

Thus, one or more components of system 4000 may be mounted in view ofscene 4030 to provide real-time and/or enhanced infrared monitoring ofscene 4030 in low light situations.

Turning to FIG. 35, FIG. 35 illustrates a flowchart of a process 4100 toenhance infrared imaging of a scene in accordance with an embodiment ofthe disclosure. For example, one or more portions of process 4100 may beperformed by processor 4010 and/or each of imaging modules 4002 a-b ofsystem 4000 and utilizing any of optical elements 4004 a-b, memory 4012,communication module 4014, display 4016, or other components 4018, whereeach of imaging modules 4002 a-b and/or optical elements 40104 a-b maybe mounted in view of at least a portion of scene 4030. In someembodiments, some elements of system 4000 may be mounted in adistributed manner (e.g., be placed in different areas inside or outsideof scene 4030) and be coupled wirelessly to each other using one or morecommunication modules 4014. In further embodiments, imaging modules 4002a-b may be situated out of view of scene 4030 but may receive views ofscene 4030 through optical elements 4004 a-b.

It should be appreciated that system 4000 and scene 4030 are identifiedonly for purposes of giving examples and that any other suitable systemmay include one or more components mounted in view of any other type ofscene and perform all or part of process 4100. It should also beappreciated that any step, sub-step, sub-process, or block of process4100 may be performed in an order or arrangement different from theembodiment illustrated by FIG. 35. For example, although process 4100describes visible spectrum images being captured before infrared imagesare captured, in other embodiments, visible spectrum images may becaptured after infrared images are captured.

In some embodiments, any portion of process 4100 may be implemented in aloop so as to continuously operate on a series of infrared and/orvisible spectrum images, such as a video of scene 4030. In otherembodiments, process 4100 may be implemented in a partial feedback loopincluding display of intermediary processing (e.g., after or whilereceiving infrared and/or visible spectrum images, performingpreprocessing operations, generating combined images, performing postprocessing operations, or performing other processing of process 4100)to a user, for example, and/or including receiving user input, such asuser input directed to any intermediary processing step.

At block 4102, system 4000 may receive (e.g., accept) user input. Forexample, display 4016 and/or other components 4018 may include a userinput device, such as a touch-sensitive screen, keyboard, mouse, dial,or joystick. Processor 4010 of system 4000 may be configured to promptfor user input. For example, system 4000 may prompt a user to select ablending or a high contrast mode for generating combined images of scene4030, and upon receiving user input, system 4000 may proceed with aselected mode.

At block 4104, system 4000 may determine one or more threshold valuesfor use in process 4100. For example, processor 4010 and/or imagingmodules 4002 a-b may be configured to determine threshold values fromuser input received in block 4102. In one embodiment, processor 4010 maybe configured to determine threshold values from images and/or imagedata captured by one or more modules of system 4000. In variousembodiments, processor 4010 may be configured to use such thresholdvalues to set, adjust, or refine one or more control parameters,blending parameters, or other operating parameters as described herein.For example, threshold values may be associated with one or moreprocessing operations, such as blocks 4120-4140 of FIG. 35, for example.

At block 4110, system 4000 may capture one or more visible spectrumimages. For example, processor 4010 and/or visible spectrum imagingmodule 4002 a may be configured to capture a visible spectrum image ofscene 4030 at a first time, such as while scene 4030 is visiblyilluminated. In one embodiment, processor 4010, visible spectrum imagingmodule 4002 a, and/or other components 4018 may be configured to detectcontext data, such as time of day and/or lighting or environmentalconditions, and determine an appropriate first time by determining thatthere is sufficient ambient light and environmental clarity to capture avisible spectrum image with enough detail and/or contrast to discernobjects or to generate a combined image with sufficient detail and/orcontrast for a particular application of system 4000, such as intrusionmonitoring or fire safety monitoring. In other embodiments, processor4010 and/or visible spectrum imaging module 4002 a may be configured tocapture visible spectrum images according to user input and/or aschedule. Visible spectrum imaging module 4002 a may be configured tocapture visible images in a variety of color spaces/formats, including araw or uncompressed format. In other embodiments, visible spectrumimages (or other non-thermal images) may be captured using an additionaldevice such as a user device (e.g., user device 1250) that is releasablyattached to system 4000.

At block 4112, system 4000 may receive and/or store visible spectrumimages and associated context information. For example, processor 4010and/or visible spectrum imaging module 4002 a may be configured toreceive visible spectrum images of scene 4030 from a sensor portion ofvisible spectrum imaging module 4002 a, to receive context data fromother components 4018, and then to store the visible spectrum imageswith the context data in a memory portion of visible spectrum imagingmodule 4002 a and/or memory 4012.

Context data may include various properties and ambient conditionsassociated with an image of scene 4030, such as a timestamp, an ambienttemperature, an ambient barometric pressure, a detection of motion inscene 4030, an orientation of one or more of imaging modules 4002 a-b, aconfiguration of one or more of optical elements 4004 a-b, the timeelapsed since imaging has begun, and/or the identification of objectswithin scene 4030 and their coordinates in one or more of the visiblespectrum or infrared images.

Context data may guide how an image may be processed, analyzed, and/orused. For example, context data may reveal that an image has been takenwhile an ambient light level is high. Such information may indicate thata captured visible spectrum image may need additional exposurecorrection pre-processing. In this and various other ways, context datamay be utilized (e.g., by processor 4010) to determine an appropriateapplication of an associated image. Context data may also supply inputparameters for performing image analytics and processing as furtherdescribed in detail below. In different embodiments, context data may becollected, processed, or otherwise managed at a processor (e.g.,processor 4010) directly without being stored at a separate memory.

Visible spectrum images may be stored in a variety of colorspaces/formats that may or may not be the color space/format of thereceived visible spectrum images. For example, processor 4010 may beconfigured to receive visible spectrum images from visible spectrumimaging module 4002 a in an RGB color space, then convert and save thevisible spectrum images in a YCbCr color space. In other embodiments,processor 4010 and/or visible spectrum imaging module 4002 a may beconfigured to perform other image processing on received visiblespectrum images prior to storing the images, such as scaling, gaincorrection, color space matching, and other preprocessing operationsdescribed herein with respect to block 4120.

At block 4114, system 4000 may optionally be configured to wait a periodof time. For example, processor 4010 may be configured to wait untilscene 4030 is not visibly illuminated (e.g., in the visible spectrum),or until scene 4030 is obscured in the visible spectrum by environmentalconditions, for instance, before proceeding with process 4100. In otherembodiments, processor 4010 may be configured to wait a scheduled timeperiod or until a scheduled time before proceeding with process 4100.The time and/or time period may be adjustable depending on ambient lightlevels and/or environmental conditions, for example. In someembodiments, the period of time may be a substantial period of time,such as twelve hours, days, weeks, or other time period that isrelatively long compared to a typical time for motion of objects (e.g.,vehicles, pedestrians) within scene 4030.

At block 4116, system 4000 may capture one or more infrared images. Forexample, processor 4010 and/or infrared imaging module 4002 b may beconfigured to capture an infrared image of scene 4030 at a second time,such as while scene 4030 is not visibly illuminated, or after aparticular time period enforced in block 4114.

In some embodiments, the second time may be substantially different fromthe first time referenced in block 4110, relative to the time typicallyneeded for a transient object to enter and leave scene 4030, forexample. Processor 4010 and/or infrared imaging module 4002 b may beconfigured to detect context data, such as time, date, and lightingconditions, and determine an appropriate second time by determining thatambient light levels are too low to capture a visible spectrum imagewith sufficient detail and/or contrast to discern objects in scene 4030according to a particular application of system 4000. In someembodiments, processor 4010 and/or infrared imaging module 4002 b may beconfigured to determine an appropriate second time by analyzing one ormore visible spectrum and/or infrared images captured by imaging modules4002 a-b. In other embodiments, processor 4010 and/or infrared imagingmodule 4002 b may be configured to capture infrared images according touser input and/or a schedule. Infrared imaging module 4002 b may beconfigured to capture infrared images in a variety of colorspaces/formats, including a raw or uncompressed format. Such images mayinclude radiometric data encoded into a radiometric component of theinfrared images.

At block 4118, system 4000 may receive and/or store infrared images andassociated context information. For example, processor 4010 and/orinfrared imaging module 4002 b may be configured to receive infraredimages of scene 4030 from a sensor portion of infrared imaging module4002 a, to receive context data from other components 4018, and then tostore the infrared images with the context data in a memory portion ofinfrared imaging module 4002 b and/or memory 4012. Context data mayinclude various properties and ambient conditions associated with animage, for example, and may guide how an image may be processed,analyzed, and/or used.

Infrared images may be stored in a variety of color spaces/formats thatmay or may not be the color space/format of the received infraredimages. For example, processor 4010 may be configured to receiveinfrared images from infrared imaging module 4002 b in a raw radiometricdata format, then convert and save the infrared images in a YCbCr colorspace. In some embodiments, radiometric data may be encoded entirelyinto a luminance (e.g., Y) component, a chrominance (e.g., Cr and Cb)component, or both the luminance and chrominance components of theinfrared images, for example. In other embodiments, processor 4010and/or infrared imaging module 4002 b may be configured to perform otherimage processing on received infrared images prior to storing theimages, such as scaling, gain correction, color space matching, andother preprocessing operations described herein with respect to block4120.

At block 4120, system 4000 may perform a variety of preprocessingoperations. For example, one or more of imaging modules 4002 a-b and/orprocessor 4010 may be configured to perform one or more preprocessingoperations on visible spectrum and/or infrared images of scene 4030captured by imaging modules 4002 a-b.

Preprocessing operations may include a variety of numerical, bit, and/orcombinatorial operations performed on all or a portion of an image, suchas on a component of an image, for example, or a selection of pixels ofan image, or on a selection or series of images. In one embodiment,processing operations may include operations for correcting fordiffering FOVs and/or parallax resulting from imaging modules 4002 a-bhaving different FOVs or non-co-linear optical axes. Such correctionsmay include image cropping, image morphing (e.g., mapping of pixel datato new positions in an image), spatial filtering, and resampling, forexample. In another embodiment, a resolution of the visible spectrumand/or infrared images may be scaled to approximate or match aresolution of a corresponding image (e.g., visible spectrum to infrared,or infrared to visible spectrum), a portion of an image (e.g., for apicture-in-picture (PIP) effect), a resolution of display 4016, or aresolution specified by a user, monitoring system, or particular imageprocessing step. Resolution scaling may include resampling (e.g.,up-sampling or down-sampling) an image, for example, or may includespatial filtering and/or cropping an image.

In another embodiment, preprocessing operations may include temporaland/or spatial noise reduction operations, which may be performed onvisible spectrum and/or infrared images, and which may include using aseries of images, for example, provided by one or both of imagingmodules 4002 a-b. In a further embodiment, a NUC process may beperformed on the captured and stored images to remove noise therein, forexample, by using various NUC techniques disclosed herein. In anotherembodiment, other calibration processes for infrared images may beperformed, such as profiling, training, baseline parameter construction,and other statistical analysis on one or more images provided by one orboth of imaging modules 4002 a-b. Calibration parameters resulting fromsuch processes may be applied to images to correct, calibrate, orotherwise adjust radiometric data in infrared images, for example, or tocorrect color or intensity data of one or more visible spectrum images.

In one embodiment, an image may be analyzed to determine a distributionof intensities for one or more components of the image. An overall gainand/or offset may be determined for the image based on such adistribution, for example, and used to adjust the distribution so thatit matches an expected (e.g., corrected) or desired (e.g., targeted)distribution. In other embodiments, an overall gain and/or offset may bedetermined so that a particular interval of the distribution utilizesmore of the dynamic range of the particular component or components ofthe image.

In some embodiments, a dynamic range of a first image (e.g., aradiometric component of an infrared image) may be normalized to thedynamic range of a second image (e g a luminance component of a visiblespectrum image). In other embodiments, a dynamic range of a particularimage may be adjusted according to a histogram equalization method, alinear scaling method, or a combination of the two, for example, todistribute the dynamic range according to information contained in aparticular image or selection of images.

In further embodiments, adjustments and/or normalizations of dynamicranges or other aspects of images may be performed while retaining acalibration of a radiometric component of an infrared image. Forexample, a dynamic range of a non-radiometric component of an infraredimage may be adjusted without adjusting the dynamic range of theradiometric component of infrared image. In other embodiments, theradiometric component of an infrared image may be adjusted to emphasizea particular thermal interval, for example, and the adjustment may bestored with the infrared image so that accurate temperaturecorrespondence (e.g., a pseudo-color and/or intensity correspondence)may be presented to a user along with a user-viewable imagecorresponding to the thermal image and/or a combined image includinginfrared characteristics derived from the infrared image.

In other embodiments, preprocessing operations may include convertingvisible spectrum and/or infrared images to a different or common colorspace. In other embodiments, images in a raw or uncompressed format maybe converted to a common RGB or YCbCr color space. In some embodiments,a pseudo-color palette, such as a pseudo-color palette chosen by a userin block 4102, may be applied as part of the preprocessing operationsperformed in block 4120. As with the dynamic range adjustments,application of color palettes may be performed while retaining acalibration of a radiometric component of an infrared image, forexample, or a color space calibration of a visible spectrum image.

In another embodiment, preprocessing operations may include decomposingimages into various components. For example, an infrared image in acolor space/format including a raw or uncompressed radiometric componentmay be converted into an infrared image in a YCbCr color space. The rawradiometric component may be encoded into a luminance (e.g., Y)component of the converted infrared image, for example, or into achrominance (e.g., Cr and/or Cb) component of the converted infraredimage, or into the luminance and chrominance components of the convertedinfrared image. In some embodiments, unused components may be discarded,for example, or set to a known value (e.g., black, white, grey, or aparticular primary color). Visible spectrum images may also be convertedand decomposed into constituent components, for example, in a similarfashion. The decomposed images may be stored in place of the originalimages, for example, and may include context data indicating all colorspace conversions and decompositions so as to potentially retain aradiometric and/or color space calibration of the original images

More generally, preprocessed images may be stored in place of originalimages, for example, and may include context data indicating all appliedpreprocessing operations so as to potentially retain a radiometricand/or color space calibration of the original images.

At block 4130, system 4000 may generate one or more combined images fromthe captured and/or preprocessed images. For example, one or more ofimaging modules 4002 a-b and/or processor 4010 (or, if desired, aprocessor of a releasably attached user device) may be configured togenerate combined images of scene 4030 from visible spectrum andinfrared images captured by imaging modules 4002 a-b. In one embodiment,the visible spectrum images may be captured prior to the infraredimages. In an alternative embodiment, the infrared images may becaptured prior to the visible spectrum images. Such combined images mayserve to provide enhanced imagery as compared to imagery provided by thevisible spectrum or infrared images alone.

In one embodiment, processor 4010 may be configured to generate combinedimages according to a true color mode. For example, a combined image mayinclude a radiometric component of an infrared image of scene 4030blended with a corresponding component of a visible spectrum imageaccording to a blending parameter. In such embodiments, the remainingportions of the combined image may be derived from correspondingportions of the visible spectrum and/or infrared images of scene 4030.

In another embodiment, processor 4010 may be configured to generatecombined images according to a high contrast mode. For example, acombined image may include a radiometric component of an infrared imageand a blended component including infrared characteristics of scene 4030blended with high spatial frequency content, derived from visiblespectrum and/or infrared images, according to a blending parameter.

More generally, processor 4010 may be configured to generate combinedimages that increase or refine the information conveyed by either thevisible spectrum or infrared images viewed by themselves. Combinedimages may be stored in memory 4012, for example, for subsequentpost-processing and/or presentation to a user or a monitoring system,for instance, or may be used to generate control signals for one or moreother components 4018.

At block 4140, system 4000 may perform a variety of post-processingoperations on combined images. For example, one or more of imagingmodules 4002 a-b and/or processor 4010 may be configured to perform oneor more post-processing operations on combined images generated fromvisible spectrum and infrared characteristics of scene 4030, forexample, derived from images captured by imaging modules 4002 a-b.

Similar to the preprocessing operations described with respect to block4120, post-processing operations may include a variety of numerical,bit, and/or combinatorial operations performed on all or a portion of animage, such as on a component of an image, for example, or a selectionof pixels of an image, or on a selection or series of images. Forexample, any of the dynamic range adjustment operations described abovewith respect to preprocessing operations performed on captured imagesmay also be performed on one or more combined images. In one embodiment,a particular color-palette, such as a night or day-time palette, or apseudo-color palette, may be applied to a combined image. For example, aparticular color-palette may be designated by a user in block 4102, ormay be determined by context or other data, such as a current time ofday, a type of combined image, or a dynamic range of a combined image.

In other embodiments, post-processing operations may include adding highresolution noise to combined images in order to decrease an impressionof smudges or other artifacts potentially present in the combinedimages. In one embodiment, the added noise may include high resolutiontemporal noise (e.g., “white” signal noise). In further embodiments,post-processing operations may include one or more noise reductionoperations to reduce or eliminate noise or other non-physical artifactsintroduced into the combined images by image processing, for example,such as aliasing, banding, dynamic range excursion, and numericalcalculation-related bit-noise.

In some embodiments, post-processing operations may includecolor-weighted (e.g., chrominance-weighted) adjustments to luminancevalues of an image in order to ensure that areas with extensive colordata are emphasized over areas without extensive color data. Forexample, where a radiometric component of an infrared image is encodedinto a chrominance component of a combined image, in block 4130, forexample, a luminance component of the combined image may be adjusted toincrease the luminance of areas of the combined image with a high levelof radiometric data. A high level of radiometric data may correspond toa high temperature or temperature gradient, for example, or an area ofan image with a broad distribution of different intensity infraredemissions (e.g., as opposed to an area with a narrow or unitarydistribution of intensity infrared emissions). Other normalizedweighting schemes may be used to shift a luminance component of acombined image for pixels with significant color content. In alternativeembodiments, luminance-weighted adjustments to chrominance values of animage may be made in a similar manner.

More generally, post-processing operations may include using one or morecomponents of a combined image to adjust other components of a combinedimage in order to provide automated image enhancement. In someembodiments, post-processing operations may include adjusting a dynamicrange, a resolution, a color space/format, or another aspect of combinedimages to match or approximate a corresponding aspect of a display, forexample, or a corresponding aspect expected by a monitoring system orselected by a user.

Post-processed combined images may be stored in place of originalcombined images, for example, and may include context data indicatingall applied post-processing operations so as to potentially retain aradiometric and/or color space calibration of the original combinedimages.

At block 4150, system 4000 may generate control signals related to thecombined images. For example, processor 4010 may be configured togenerate control signals adapted to energize and/or operate any of analarm, a siren, a messaging system, a security light, or one or more ofother components 4018, according to conditions detected from theenhanced imagery provided by the combined images. Such control signalsmay be generated when a combined image contains a detected object orcondition, such as one or more of pedestrians 4050 and/or vehicle 4040entering or idling in scene 4030, for example. In other embodiments,processor 4010 may be configured to generate control signals notifying amonitoring system of detected objects or conditions in scene 4030.

At block 4152, system 4000 may display images to a user. For example,processor 4010 may be configured to convert visible spectrum, infrared,and/or combined images (e.g., from block 4130 and/or 4140) intouser-viewable combined images and present the user-viewable combinedimages to a user utilizing display 4016. In other embodiments, processor4010 may also be configured to transmit combined images, includinguser-viewable combined images, to a monitoring system (e.g., usingcommunication module 4014) for further processing, notification, controlsignal generation, and/or display to remote users. As noted above,embodiments of process 4100 may include additional embodiments of block4152, for example. In some embodiments, one or more embodiments of block4152 may be implemented as part of one or more feedback loops, forexample, which may include embodiments of blocks 4102 and/or 4104.

At block 4154, system 4000 may store images and other associated data.For example, processor 4010 may be configured to store one or more ofthe visible spectrum, infrared, or combined images, including associatedcontext data and other data indicating pre-and-post-processingoperations, to memory 4012, for example, or to an external or portablememory device.

FIG. 36 illustrates a flowchart of a process 4200 to combine thermalimages and non-thermal images of a scene in accordance with anembodiment of the disclosure. For example, one or more portions ofprocess 4200 may be performed by processor 4010 and/or each of imagingmodules 4002 a-b of system 4000 and utilizing any of optical elements4004 a-b, memory 4012, communication module 4014, display 4016, or othercomponents 4018, where each of imaging modules 4002 a-b and/or opticalelements 4004 a-b may be mounted in view of at least a portion of scene4030. In some embodiments, process 4200 may be implemented as anembodiment of block 6204 in process 6200 of FIG. 27, for example, togenerate processed images such as multi-spectrum images from capturedthermal infrared images and non-thermal images captured in block 6202 inprocess 6200.

It should also be appreciated that any step, sub-step, sub-process, orblock of process 4200 may be performed in an order or arrangementdifferent from the embodiment illustrated by FIG. 36. For example,although process 4200 describes distinct blending and high-contrastmodes, in other embodiments, captured images may be combined using anyportion, order, or combination of the blending and/or high-contrast modeprocessing operations. In some embodiments, any portion of process 4200may be implemented in a loop so as to continuously operate on a seriesof infrared and/or visible spectrum images, such as a video of a scene.

At block 4230, processor 4010 may receive captured thermal images andnon-thermal images (e.g., thermal infrared images and visible spectrumimages). The thermal images and non-thermal images may be captured invarious manners described for block 6202 of process 6200, for example.Once the captured thermal images and non-thermal images are received,processor 4010 may determine a mode for generating combined images. Suchmode may be selected by a user in block 4102 of FIG. 35, for example, ormay be determined according to context data or an alternating mode, forinstance, where the mode of operation alternates between configuredmodes upon a selected schedule or a particular monitoring systemexpectation.

In the embodiment illustrated by FIG. 36, the processor may determine atrue color mode, including one or more of blocks 4233 and 4235, or ahigh contrast mode, including one or more of blocks 4232, 4234, and4236. In other embodiments, process 4200 may include other selectablemodes including processes different from those depicted in FIG. 36, forexample, or may include only a single mode, such as a mode including oneor more adjustable blending parameters. In embodiments with multiplepossible modes, once a mode is determined, process 4200 may proceed withthe selected mode.

At block 4233, system 4000 may perform various pre-combining operationson one or more of the thermal images and non-thermal images. Forexample, if a true color mode is determined in block 4230, processor4010 may be configured to perform pre-combining operations on one ormore thermal images and/or non-thermal images received in block 4230. Inone embodiment, pre-combining operations may include any of thepre-processing operations described with respect to block 4120 of FIG.35. For example, the color spaces of the received images may beconverted and/or decomposed into common constituent components.

In other embodiments, pre-combining operations may include applying ahigh pass filter, applying a low pass filter, a non-linear low passfiler (e.g., a median filter), adjusting dynamic range (e.g., through acombination of histogram equalization and/or linear scaling), scalingdynamic range (e.g., by applying a gain and/or an offset), and addingimage data derived from these operations to each other to form processedimages. For example, a pre-combining operation may include extractingdetails and background portions from a radiometric component of aninfrared image using a high pass spatial filter, performing histogramequalization and scaling on the dynamic range of the background portion,scaling the dynamic range of the details portion, adding the adjustedbackground and details portions to form a processed infrared image, andthen linearly mapping the dynamic range of the processed infrared imageto the dynamic range of a display. In one embodiment, the radiometriccomponent of the infrared image may be a luminance component of theinfrared image. In other embodiments, such pre-combining operations maybe performed on one or more components of visible spectrum images.

As with other image processing operations, pre-combining operations maybe applied in a manner so as to retain a radiometric and/or color spacecalibration of the original received images. Resulting processed imagesmay be stored and/or may be further processed according to block 4235.

At block 4235, processor 4010 may blend one or more non-thermal (e.g.,visible spectrum images or other non-thermal images) with one or morethermal images. For example, processor 4010 may be configured to blendone or more visible spectrum images with one or more thermal infraredimages, where the one or more visible spectrum and/or thermal infraredimages may be processed versions (e.g., according to block 4233) ofimages originally received in block 4230.

In one embodiment, blending may include adding a radiometric componentof an infrared image to a corresponding component of a visible spectrumimage, according to a blending parameter. For example, a radiometriccomponent of an infrared image may be a luminance component (e.g., Y) ofthe infrared image. In such an embodiment, blending the infrared imagewith a visible spectrum image may include proportionally adding theluminance components of the images according to a blending parameter ζand the following first blending equation:YCI=ζ*YVSI+(1−ζ)*YIRI

where YCI is the luminance component of the combined image, YVSI is theluminance of the visible spectrum image, YIRI is the luminance componentof the infrared image, and ζ varies from 0 to 1. In this embodiment, theresulting luminance component of the combined image is the blended imagedata.

In other embodiments, where a radiometric component of an infrared imagemay not be a luminance component of the infrared image, blending aninfrared image with a visible spectrum image may include addingchrominance components of the images according to the first blendingequation (e.g., by replacing the luminance components with correspondingchrominance components of the images), and the resulting chrominancecomponent of the combined image is blended image data. More generally,blending may include adding (e.g., proportionally) a component of aninfrared image, which may be a radiometric component of the infraredimage, to a corresponding component of a visible spectrum image. Onceblended image data is derived from the components of the visiblespectrum and infrared images, the blended image data may be encoded intoa corresponding component of the combined image, as further describedwith respect to block 4238. In some embodiments, encoding blended imagedata into a component of a combined image may include additional imageprocessing steps, for example, such as dynamic range adjustment,normalization, gain and offset operatinns, and color space conversions,for instance.

In embodiments where radiometric data is encoded into more than onecolor space/format component of an infrared image, the individual colorspace/format components of the infrared and visible spectrum images maybe added individually, for example, or the individual color spacecomponents may be arithmetically combined prior to adding the combinedcolor space/format components.

In further embodiments, different arithmetic combinations may be used toblend visible spectrum and infrared images. For example, blending aninfrared image with a visible spectrum image may include adding theluminance components of the images according to a blending parameter ζand the following second blending equation:YCI=ζ*YVSI+YIRI

where YCI, YVSI, and YIRI are defined as above with respect to the firstblending equation, and ζ varies from 0 to values greater than a dynamicrange of an associated image component (e.g., luminance, chrominance,radiometric, or other image component). As with the first blendingequation, the second blending equation may be used to blend othercomponents of an infrared image with corresponding components of avisible spectrum image. In other embodiments, the first and secondblending equations may be rewritten to include per-pixel color-weightingor luminance-weighting adjustments of the blending parameter, forexample, similar to the component-weighted adjustments described withrespect to block 4140 of FIG. 35, in order to emphasize an area with ahigh level of radiometric data.

In some embodiments, image components other than those corresponding toa radiometric component of an infrared image may be truncated, set to aknown value, or discarded. In other embodiments, the combined imagecomponents other than those encoded with blended image data may beencoded with corresponding components of either the visible spectrum orthe infrared images. For example, in one embodiment, a combined imagemay include a chrominance component of a visible spectrum image encodedinto a chrominance component of the combined image and blended imagedata encoded into a luminance component of the combined image, where theblended image data comprises a radiometric component of an infraredimage blended with a luminance component of the visible spectrum image.In alternative embodiments, a combined image may include a chrominancecomponent of the infrared image encoded into a chrominance component ofthe combined image.

A blending parameter value may be selected by a user, or may bedetermined by the processor according to context or other data, forexample, or according to an image enhancement level expected by acoupled monitoring system. In some embodiments, the blending parametermay be adjusted or refined using a knob, joystick, or keyboard coupledto the processor, for example, while a combined image is being displayedby a display. From the first and second blending equations, in someembodiments, a blending parameter may be selected such that blendedimage data includes only infrared characteristics, or, alternatively,only visible spectrum characteristics.

In addition to or as an alternative to the processing described above,processing according to a true color mode may include one or moreprocessing steps, ordering of processing steps, arithmetic combinations,and/or adjustments to blending parameters as disclosed in U.S. patentapplication Ser. No. 12/477,828 filed Jun. 3, 2009 which is herebyincorporated by reference in its entirety. For example, blendingparameter ζ may be adapted to affect the proportions of two luminancecomponents of an infrared image and a visible spectrum image. In oneaspect, ζ may be normalized with a value in the range of 0 (zero) to 1,wherein a value of 1 produces a blended image (e.g., blended image data,and/or a combined image) that is similar to the visible spectrum image.On the other hand, if ζ is set to 0, the blended image may have aluminance similar to the luminance of the infrared image. However, inthe latter instance, the chrominance (Cr and Cb) from the visible imagemay be retained. Each other value of ζ may be adapted to produce ablended image where the luminance part (Y) includes information fromboth the visible spectrum and infrared images. For example, ζ may bemultiplied to the luminance part (Y) of the visible spectrum image andadded to the value obtained by multiplying the value of 1−ζ to theluminance part (Y) of the infrared image. This added value for theblended luminance parts (Y) may be used to provide the blended image(e.g., the blended image data, and/or the combined image).

In one embodiment, a blending algorithm may be referred to as true colorinfrared imagery. For example, in daytime imaging, a blended image maycomprise a visible spectrum color image, which includes a luminanceelement and a chrominance element, with its luminance value replaced bythe luminance value from a thermal infrared image. The use of theluminance data from the thermal infrared image causes the intensity ofthe true visible spectrum color image to brighten or dim based on thetemperature of the object. As such, the blending algorithm providesthermal IR imaging for daytime or visible light images.

After one or more visible spectrum images (or other non-thermal images)are blended with one or more infrared images such as thermal images,processing may proceed to block 4238, where blended data may be encodedinto components of the combined images in order to form the combinedimages.

At block 4232, processor 4010 may derive high spatial frequency contentfrom one or more of the thermal images and non-thermal images. Forexample, if a high contrast mode is determined in block 4230, processor4010 may be configured to derive high spatial frequency content from oneor more of the thermal images and non-thermal images received in block4230.

In one embodiment, high spatial frequency content may be derived from animage by performing a high pass filter (e.g., a spatial filter)operation on the image, where the result of the high pass filteroperation is the high spatial frequency content. In an alternativeembodiment, high spatial frequency content may be derived from an imageby performing a low pass filter operation on the image, and thensubtracting the result from the original image to get the remainingcontent, which is the high spatial frequency content. In anotherembodiment, high spatial frequency content may be derived from aselection of images through difference imaging, for example, where oneimage is subtracted from a second image that is perturbed from the firstimage in some fashion, and the result of the subtraction is the highspatial frequency content. For example, optical elements of a camera maybe configured to introduce vibration, focus/de-focus, and/or movementartifacts into a series of images captured by one or both of an infraredcamera and a non-thermal camera. High spatial frequency content may bederived from subtractions of adjacent or semi-adjacent images in theseries.

In some embodiments, high spatial frequency content may be derived fromonly the non-thermal images or only from the thermal images. In otherembodiments, high spatial frequency content may be derived from only asingle thermal or non-thermal image. In further embodiments, highspatial frequency content may be derived from one or more components ofthermal images and/or non-thermal images, such as a luminance componentof a visible spectrum image, for example, or a radiometric component ofa thermal infrared image. Resulting high spatial frequency content maybe stored temporarily and/or may be further processed according to block4234.

At block 4234, processor 4010 may de-noise one or more thermal images.For example, processor 4010 may be configured to de-noise, smooth, orblur one or more infrared images using a variety of image processingoperations. In one embodiment, removing high spatial frequency noisefrom thermal images allows processed thermal images to be combined withhigh spatial frequency content derived according to block 4232 withsignificantly less risk of introducing double edges (e.g., edge noise)to objects depicted in combined images.

In one embodiment, removing noise from thermal images may includeperforming a low pass filter (e.g., a spatial and/or temporal filter)operation on the image, where the result of the low pass filteroperation is a de-noised or processed thermal image. In a furtherembodiment, removing noise from one or more thermal images may includedown-sampling the thermal images and then up-sampling the images back tothe original resolution.

In another embodiment, processed thermal images may be derived byactively blurring thermal images. For example, optical elements 4004 bmay be configured to slightly de-focus one or more thermal imagescaptured by infrared imaging module 4002 b. The resulting intentionallyblurred thermal images may be sufficiently de-noised or blurred so as toreduce or eliminate a risk of introducing double edges into combinedimages, as further described below. In other embodiments, blurring orsmoothing image processing operations may be performed by processor 4010on thermal images received at block 4230 as an alternative or supplementto using optical elements 4004 b to actively blur infrared images.Resulting processed infrared images may be stored temporarily and/or maybe further processed according to block 4236.

At block 4236, processor 4010 may blend high spatial frequency contentwith one or more thermal images. For example, the processor may beconfigured to blend high spatial frequency content derived in block 4232with one or more thermal images, such as the processed thermal imagesprovided in block 4234.

In one embodiment, high spatial frequency content may be blended withthermal images by superimposing the high spatial frequency content ontothe thermal images, where the high spatial frequency content replaces oroverwrites those portions of the thermal images corresponding to wherethe high spatial frequency content exists. For example, the high spatialfrequency content may include edges of objects depicted in images, butmay not exist within the interior of such objects. In such embodiments,blended image data may simply include the high spatial frequencycontent, which may subsequently be encoded into one or more componentsof combined images, as described in block 4238.

For example, a radiometric component of a thermal image may be achrominance component of the thermal image, and the high spatialfrequency content may be derived from the luminance and/or chrominancecomponents of a visible spectrum image. In this embodiment, a combinedimage may include the radiometric component (e.g., the chrominancecomponent of the thermal image) encoded into a chrominance component ofthe combined image and the high spatial frequency content directlyencoded (e.g., as blended image data but with no thermal imagecontribution) into a luminance component of the combined image. By doingso, a radiometric calibration of the radiometric component of thethermal image may be retained. In similar embodiments, blended imagedata may include the high spatial frequency content added to a luminancecomponent of the thermal images, and the resulting blended data encodedinto a luminance component of resulting combined images.

In other embodiments, high spatial frequency content may be derived fromone or more particular components of one or a series of non-thermalimages and/or thermal images, and the high spatial frequency content maybe encoded into corresponding one or more components of combined images.For example, the high spatial frequency content may be derived from aluminance component of a visible spectrum image, and the high spatialfrequency content, which in this embodiment is all luminance image data,may be encoded into a luminance component of a combined image.

In another embodiment, high spatial frequency content may be blendedwith thermal images using a blending parameter and an arithmeticequation, such as the first and second blending equations, above. Forexample, in one embodiment, the high spatial frequency content may bederived from a luminance component of a visible spectrum image. In suchan embodiment, the high spatial frequency content may be blended with acorresponding luminance component of a thermal image according to ablending parameter and the second blending equation to produce blendedimage data. The blended image data may be encoded into a luminancecomponent of a combined image, for example, and the chrominancecomponent of the thermal image may be encoded into the chrominancecomponent of the combined image. In embodiments where the radiometriccomponent of the infrared image is its chrominance component, thecombined image may retain a radiometric calibration of the thermalimage. In other embodiments, portions of the radiometric component maybe blended with the high spatial frequency content and then encoded intoa combined image.

More generally, the high spatial frequency content may be derived fromone or more components of a thermal image and/or a non-thermal image. Insuch an embodiment, the high spatial frequency content may be blendedwith one or more components of the thermal image to produce blendedimage data (e.g., using a blending parameter and a blending equation),and a resulting combined image may include the blended image dataencoded into corresponding one or more components of the combined image.In some embodiments, the one or more components of the blended data donot have to correspond to the eventual one or more components of thecombined image (e.g., a color space/format conversion may be performedas part of an encoding process).

A blending parameter value may be selected by a user or may beautomatically determined by the processor according to context or otherdata, for example, or according to an image enhancement level expectedby a coupled monitoring system. In some embodiments, the blendingparameter may be adjusted or refined using a control component (e.g., aswitch, button, or touch screen) of system 4000, for example, while acombined image is being displayed by display 4016. In some embodiments,a blending parameter may be selected such that blended image dataincludes only thermal characteristics, or, alternatively, onlynon-thermal characteristics. A blending parameter may also be limited inrange, for example, so as not to produce blended data that isout-of-bounds with respect to a dynamic range of a particular colorspace/format or a display.

In addition to or as an alternative to the processing described above,processing according to a high contrast mode may include one or moreprocessing steps, ordering of processing steps, arithmetic combinations,and/or adjustments to blending parameters as disclosed in U.S. patentapplication Ser. No. 13/437,645 filed Apr. 2, 2012 which is herebyincorporated by reference in its entirety. For example, the followingequations may be used to determine the components Y, Cr and Cb for thecombined image with the Y component from the high pass filtered visiblespectrum image and the Cr and Cb components from the thermal image.hp_y_vis=highpass(y_vis)(y_ir,cr_ir,cb_ir)=colored(lowpass(ir_signal_linear))

which in another notation could be written as:hp _(y) _(vis) =highpass(y _(vis))(v _(ir) cr _(ir) ,cb _(ir))=colored (lowpass(ir _(signal linear)))

In the above equations, highpass(y_vis) may be high spatial frequencycontent derived from high pass filtering a luminance component of avisible spectrum image. Colored(lowpass(ir_signal_linear)) may be theresulting luminance and chrominance components of the thermal imageafter the thermal image is low pass filtered. In some embodiments, thethermal image may include a luminance component that is selected to be0.5 times a maximum luminance (e.g., of a display and/or a processingstep). In related embodiments, the radiometric component of the thermalimage may be the chrominance component of the thermal image. In someembodiments, the y_ir component of the thermal image may be dropped andthe components of the combined image may be (hp_y_vis, cr_ir, cb_ir),using the notation above.

In another embodiment, the following equations may be used to determinethe components Y, Cr and Cb for a combined image with the Y componentfrom the high pass filtered visible spectrum image and the Cr and Cbcomponents from the thermal image.comb_y=y_ir+alpha×hp_y_viscomb_cr=cr_ircomb_cb=cb_ir

which in another notation could be written as:comb_(y) =y _(ir)+alpha*hp _(y) _(vis)comb_(cr) =cr _(ir)comb_(cb) =cb _(ir)

The variation of alpha thus gives the user an opportunity to decide howmuch contrast is needed in the combined image. With an alpha of close tozero, the thermal image alone will be shown, but with a very high alpha,very sharp contours can be seen in the combined image. Theoretically,alpha can be an infinitely large number, but in practice a limitationwill probably be necessary, to limit the size of alpha that can bechosen to what will be convenient in the current application. In theabove equations, alpha may correspond to a blending parameter ζ.

Once the high spatial frequency content is blended with one or morethermal images, processing may proceed to block 4238, where blended datamay be encoded into components of the combined images in order to formthe combined images.

At block 4238, processor 4010 may encode the blended data into one ormore components of the combined images. For example, processor 4010 maybe configured to encode blended data derived or produced in accordancewith blocks 4235 and/or 4236 into a combined image that increases,refines, or otherwise enhances the information conveyed by either thethermal images or non-thermal images viewed by themselves.

In some embodiments, encoding blended image data into a component of acombined image may include additional image processing steps, forexample, such as dynamic range adjustment, normalization, gain andoffset operations, noise reduction, and color space conversions, forinstance.

In addition, processor 4010 may be configured to encode other image datainto combined images. For example, if blended image data is encoded intoa luminance component of a combined image, a chrominance component ofeither a non-thermal image or a thermal image may be encoded into achrominance component of a combined image. Selection of a source imagemay be made through user input, for example, or may be determinedautomatically based on context or other data. More generally, in someembodiments, a component of a combined image that is not encoded withblended data may be encoded with a corresponding component of a thermalimage or a non-thermal image. By doing so, a radiometric calibration ofa thermal image and/or a color space calibration of a visible spectrumimage may be retained in the resulting combined image, for example. Suchcalibrated combined images may be used for enhanced thermal infraredimaging applications, particularly where constituent thermal images andnon-thermal images of a scene are captured at different times and/ordisparate ambient lighting levels.

Referring now to FIG. 37, a block diagram is illustrated of a compactimaging system 5300 adapted to image a scene in accordance with anembodiment of the disclosure. For example, system 5300 may includeimaging modules 4002 a-c (e.g., all of which may be implemented, forexample, with any of the features of infrared imaging module 100) allphysically coupled to common substrate 5310 and adapted to image a scene(e.g., scene 4030 in FIG. 34) in a variety of spectrums. In someembodiments, processor 4010, memory 4012, communication module 4014, andone or more other components 4018 may or may not be physically coupledto common substrate 5310.

In the embodiment shown in FIG. 37, system 5300 includes dual modulesocket 5320 physically coupled to common substrate 5310 and adapted toreceive two imaging modules 4002 a-b and align them to each other. Insome embodiments, dual module socket 5320 may include features similarto those found in socket 104 of FIG. 3. In further embodiments, dualmodule socket 5320 may include retainer springs, clips, or otherphysical restraint devices adapted to visibly indicate proper insertionof imaging modules through their physical arrangement or shape. Infurther embodiments, dual module socket 5320 may be adapted to provideone or more of tip, tilt, or rotational alignment of imaging modules4002 a-b that is greater (e.g., more aligned) than if the imagingmodules are directly soldered to common substrate 5310 or if they areinserted into multiple single module sockets. Dual module socket 5320may include common circuitry and/or common restrain devices used toservice imaging modules 4002 a-b, thereby potentially reducing anoverall size of system 5300 as compared to embodiments where imagingmodules 4002 a-b have individual sockets. Additionally, dual modulesocket 5320 may be adapted to reduce a parallax error between imagescaptured by imaging modules 4002 a-b by spacing the imaging modulescloser together.

Also shown is single module socket 5324 receiving imaging module 4002 cspaced from dual module socket 5320 and imaging modules 4002 a-b.Imaging module 4002 c may be sensitive to a spectrum that is the sameas, that overlaps, or is different from that sensed by either or both ofimaging modules 4002 a-b, for example. In embodiments where imagingmodule 4002 c is sensitive to a spectrum in common with either ofimaging modules 4002 a-b, system 5300 may be adapted to captureadditional images of a commonly viewed scene and image portions of thescene in stereo (e.g., 3D) in that spectrum. In such embodiments, thespatial distance between imaging module 4002 c and either of imagingmodules 4002 a-b increases the acuity of the stereo imaging byincreasing the parallax error. In some embodiments, system 5300 may beconfigured to generate combined images including stereo imagingcharacteristics of a commonly-viewed scene derived from one or moreimages captured by imaging modules 4002 a-c. In other embodiments,stereo imaging may be used to determine distances to objects in a scene,to determine autofocus parameters, to perform a range calculation, toautomatically adjust for parallax error, to generate images ofrange-specific atmospheric adsorption of infrared and/or other spectrumsin a scene, and/or for other stereo-imaging features.

In embodiments where imaging module 4002 c is sensitive to a spectrumoutside that sensed by imaging modules 4002 a-b, system 5300 may beconfigured to generate combined images including characteristics of ascene derived from three different spectral views of the scene. In suchembodiments, highly accurate facial recognition operations may beperformed using multi-spectrum images or combined images of a humanface.

Although system 5300 is depicted with dual module socket 5320 separatefrom single module socket 5324, in other embodiments, system 5300 mayinclude a triple (or higher order) module socket adapted to receivethree or more imaging modules. Moreover, where planar compactness isdesired, adjacent modules may be arranged in a multi-level staggeredarrangement such that their optical axes are placed closer together thantheir planar area would normally allow. For example, dual module socket5320 may be adapted to receive visible spectrum imaging module 4002 a ona higher (e.g., up out of the page of FIG. 37) level than infraredimaging modules 4002 b and overlap non-optically sensitive areas ofinfrared imaging module 4002 b.

Additionally shown in FIG. 37 is illuminator socket 5322 receivingilluminator module/vertical-cavity surface-emitting laser (VCSEL) 5330.System 5300 may be configured to use VCSEL 5330 to illuminate at leastportions of a scene in a spectrum sensed by one or more of imagingmodules 4002 a-c. In some embodiments, VCSEL 5330 may be selectivelytunable and/or directionally aimed by coupled microelectromechanicallenses and other systems controlled by one or more of processor 4010 andimaging modules 4002 a-c. Illuminator socket 5322 may be implemented tohave the same or similar construction as single module socket 5324, forexample, or may be implemented as a multi-module socket. In someembodiments, a thermal image may be used to detect a “hot” spot in animage, such as an image of a breaker box. An illuminator module may beused to illuminate a label of a breaker to potentially pin point thecause of the hot spot. In other embodiments, an illuminator module mayfacilitate long range license plate imaging, particularly when theilluminator is relatively collimated laser light source. In someembodiments, stereo imaging may be used to determine aiming points forVCSEL 5330.

In some embodiments, any one of processor 4010 and imaging modules 4002a-c may be configured to receive user input (e.g., from one or more ofother components 4018, a touch sensitive display coupled to system 5300,and/or any of the various user input devices discussed herein)indicating a portion of interest imaged by a first imaging module (e.g.,infrared imaging module 4002 b), control the illumination module (e.g.,VCSEL 5330) to illuminate at least the portion-of-interest in a spectrumsensed by a second imaging module (e.g., visible spectrum imaging module4002 a), receive illuminated captured images of the portion-of-interestfrom the second imaging module, and generate a combined image comprisingilluminated characteristics of the scene derived from the illuminatedcaptured images.

FIG. 38 illustrates a block diagram of a mounting system 5400 forimaging modules adapted to image a scene in accordance with anembodiment of the disclosure. For example, imaging modules 4002 a-b maybe implemented with a common housing 5440 (e.g., similar to housing 120in FIG. 3, in some embodiments) to make their placement on substrate5310 more compact and/or more aligned. As shown in FIG. 38, system 5400may include common housing socket 5420, processing modules 5404 a-b,sensor assemblies 5405 a-b, FPAs 5406 a-b, common housing 5440, and lensbarrels 5408 a-b (e.g., similar to lens barrel 110 in FIG. 3). Commonhousing 5440 may be used to further align, for example, components ofimaging modules 4002 a-b with their optical axes, rather than individualimaging modules. In the embodiment shown in FIG. 38, the imaging modulesmay retain separate optics (e.g., lens barrel 120 and optical elements180 in FIG. 3) but be placed close together to minimize parallax error.In other embodiments, common housing 5440 may be placed over entireimaging modules 4002 a-b (e.g., that retain their own individualhousings), and may be part of a housing for a portable host device, forexample.

FIG. 39 illustrates a block diagram of an arrangement 5600 of imagingmodules adapted to image a scene in accordance with an embodiment of thedisclosure. For example, in FIG. 39, at least portions of two imagingmodules 4002 a-b may be arranged in a staggered arrangement, whereportions of sensor assembly 5605 b of imaging module 4002 b (e.g.,potentially including FPA 5606 b) overlap portions of sensor assembly5605 a of imaging module 4002 a (e.g., but not overlap any portion ofFPA 5606 a).

In some embodiments, imaging modules 4002 a-b may be implemented with acommon processing module/circuit board 5604 (e.g., similar to processingmodule 160 and circuit board 170 in FIG. 3, in some embodiments). Commonprocessing module/circuit board 5604 may be implemented as anyappropriate processing device (e.g., logic device, microcontroller,processor, ASIC, a digital signal processor (DSP), an image signalprocessor (ISP), or other device, including multi-channelimplementations of the above) able to execute instructions and/orperform image processing operations as described herein. In someembodiments, common processing module/circuit board 5604 may be adaptedto use the MIPI® standard, for example, and/or to store visible spectrumand infrared images to a common data file using a common data format, asdescribed herein. In further embodiments, processor 4010 may beimplemented as a common processing module.

FIG. 40 illustrates an embodiment for device 10000 including device 1250and a releasably attached device component such as device attachment10100 (identified only for purposes of example; any of deviceattachments 1200, 1201, 1203, 2000, or others described herein may beused interchangeably in any of the embodiments described herein whereappropriate) that may be used when it is desired to capture and combinenon-thermal and/or thermal images. Furthermore, other arrangements ofdevice 10000 are contemplated, such as those illustrated in FIGS. 25-26,but with the addition of supplementary components 10110 integrated withdevice attachment 10100.

Many of the components referenced in FIG. 40 are discussed and may beimplemented similarly to those referred to in FIG. 24. In addition, asshown in FIG. 40, device attachment 10100 may include one or moresupplementary components 10110. Supplementary components 10110 mayinclude a variety of other types of sensors, such as ambient temperaturesensors, ambient humidity sensors, contact patch moisture sensors,pin-type moisture sensors, laser range finders, active illuminators(e.g., visible spectrum, near infrared, far infrared, and/ormulti-spectral illuminators, implemented with LEDs, diode lasers,VCSELs, and/or other components and/or devices), associated cabling,internal and/or external wired and/or wireless interfaces, and/or othertypes of sensors configured to supplement the functionality of deviceattachment 10100. Examples of such supplementary components and sensorsare provided in U.S. patent application Ser. No. 11/841,036 filed Aug.20, 2007 and entitled “MOISTURE METER WITH NON-CONTACT INFRAREDTHERMOMETER,” and U.S. Provisional Patent Application No. 61/938,388filed Feb. 11, 2014 and entitled “MEASUREMENT DEVICE WITH THERMALIMAGING CAPABILITIES AND RELATED METHODS,” which are hereby incorporatedby reference in their entirety.

For example, device attachment 10100 may be adapted to providefunctionality beneficial to the typical use of a ventilation systeminspector, which in some embodiments could include the functionality ofan ambient humidity sensor and/or a contact patch and/or pin-typemoisture sensor to detect moisture leaks within insulation of aventilation system. In one embodiment, a user (e.g., a ventilationinspector specialist) could use device attachment 10100 with device 1250to provide a compact handheld device that may be configured to detectthermal anomalies with infrared imaging module 1202 (e.g., as augmentedby visible spectrum image data provided by non-thermal camera module6002), detect ambient humidity anomalies with an ambient humidity sensorintegrated with supplementary components 10110, and/or to detectmoisture levels within insulation, drywall, and/or other materiallocated at or near the temperature and/or ambient humidity anomalieswith a wired, wireless, and/or integrated moisture sensor associatedand/or integrated with supplementary components 10110. In otherembodiments, other ventilation and/or environmental sensors may bewirelessly associated and/or integrated with supplementary components10110. In various embodiments, device 1250 and/or device attachment10100 may include other components, such as a GPS or other type ofgeo-spatial location sensors and/or orientation sensors, for example,such that device 10000 may be configured to link imaging data andsupplementary sensor data to a particular location and/or orientation ofdevice 10000.

In another example, device attachment 10100 may be adapted to providefunctionality beneficial to the typical use of an electrical and/orelectronics inspector, which in some embodiments could include thefunctionality of a digital oscilloscope, a voltage meter, current meter,Ohm meter (e.g., collectively a digital multi-meter), a spectrumanalyzer, a variable band antenna, and/or other types of electronic orelectrical systems sensor. In one embodiment, a user (e.g., anelectrical or electronic systems inspector specialist) could use deviceattachment 10100 with device 1250 to provide a compact handheld devicethat may be configured to detect thermal anomalies with infrared imagingmodule 1202 (e.g., as augmented by visible spectrum image data providedby non-thermal camera module 6002), detect voltages, currents, signaltransients, and/or other types of electrical and/or electronic anomaliesin a device's electronic system or a building's electrical system withcorresponding sensors associated and/or integrated with supplementarycomponents 10110. In other embodiments, other electrical, electronic,and/or other physical parameter sensors may be wirelessly associatedand/or integrated with supplementary components 10110. In variousembodiments, device 1250 and/or device attachment 10100 may includegeo-spatial location and/or orientation sensors, for example, such thatdevice 10000 may be configured to link imaging data and supplementarysensor data to a particular location and/or orientation of device 10000.

As described herein, processing of the image, sensor, or other types ofdata provided by the various components illustrated in FIG. 40 may beperformed by device processor 6102 and/or a device processor integratedwith device attachment 10100, and/or a remote processor in communicationwith device 10000. In some embodiments, operation of a particularselection of supplementary components 10110 may be facilitated by anapplication executed by device processor 6102, for example, anddisplayed to a user using a display of device 1250. In furtherembodiments, device attachment 10100 may include one or more displays orindicators separate from a display of device 1250, for example, tosupplement a display of device 1250 with data and/or other types ofinformation or alerts associated with supplementary components 10110. Inone embodiment, device 1250 may be implemented as a smart phone and beconfigured to execute an application downloaded from a server or fromdevice attachment 10100 that facilitates use of non-thermal cameramodule 6002, infrared imaging module 1202, and/or supplementarycomponents 10110, along with other functionality integrated with smartphone 1250 (e.g., network access, wireless interfaces, microphone,speaker, vibration actuator, accelerometer, gyroscope, user interfaces,random number generators, security devices, and/or other functionalityintegrated with a smart phone.

Where applicable, various embodiments provided by the present disclosurecan be implemented using hardware, software, or combinations of hardwareand software. Also where applicable, the various hardware componentsand/or software components set forth herein can be combined intocomposite components comprising software, hardware, and/or both withoutdeparting from the spirit of the present disclosure. Where applicable,the various hardware components and/or software components set forthherein can be separated into sub-components comprising software,hardware, or both without departing from the spirit of the presentdisclosure. In addition, where applicable, it is contemplated thatsoftware components can be implemented as hardware components, andvice-versa.

Software in accordance with the present disclosure, such asnon-transitory instructions, program code, and/or data, can be stored onone or more non-transitory machine readable mediums. It is alsocontemplated that software identified herein can be implemented usingone or more general purpose or specific purpose computers and/orcomputer systems, networked and/or otherwise. Where applicable, theordering of various steps described herein can be changed, combined intocomposite steps, and/or separated into sub-steps to provide featuresdescribed herein.

Embodiments described above illustrate but do not limit the invention.It should also be understood that numerous modifications and variationsare possible in accordance with the principles of the invention.Accordingly, the scope of the invention is defined only by the followingclaims.

What is claimed is:
 1. An imaging device comprising: a housingconfigured to releasably couple to a mobile user device to supportmobile operation of the imaging device in conjunction with the mobileuser device; a connector configured to provide releasable coupling anddata communication between the imaging device and the mobile userdevice; an infrared sensor assembly within the housing, the infraredsensor assembly configured to capture thermal infrared image dataassociated with a scene; and a processing module communicatively coupledto the infrared sensor assembly and configured to provide informationassociated with the thermal infrared image data through the connector tothe mobile user device.
 2. The imaging device of claim 1, wherein theconnector is further configured to pass electrical power to the mobileuser device for use by the mobile user device.
 3. The imaging device ofclaim 1, wherein the information is provided to the mobile user devicefor display, storage, and/or processing by the mobile user device. 4.The imaging device of claim 1, wherein the connector comprises aconnector plug.
 5. The imaging device of claim 1, wherein the mobileuser device is a mobile personal electronic device.
 6. The imagingdevice of claim 1, wherein the processing module is further configuredto: receive, via the connector, non-thermal image data from anon-thermal camera module of the mobile user device; and combine thenon-thermal image data and the thermal infrared image data to generatecombined image data.
 7. The imaging device of claim 1, furthercomprising a supplementary component at least partially disposed withinthe housing, the supplementary component configured to generate sensordata associated with at least a portion of the scene.
 8. The imagingdevice of claim 7, wherein the supplementary component comprises atleast one of a moisture sensor configured to generate moisture leveldata associated with the portion of the scene or an electrical parametersensor configured to generate electrical parameter data associated withthe portion of the scene.
 9. The imaging device of claim 1, furthercomprising a non-thermal camera module configured to capture firstnon-thermal image data.
 10. The imaging device of claim 9, wherein theprocessing module is further configured to receive, via the connector,second non-thermal image data from a non-thermal camera module of themobile user device.
 11. The imaging device of claim 9, wherein theprocessing module is further configured to combine the first non-thermalimage data and the thermal infrared image data to generate combinedimage data, and wherein the information associated with the thermalinfrared image data comprises information associated with the combinedimage data.
 12. A method of providing infrared imaging functionality fora mobile user device, the method comprising: releasably attaching to themobile user device an imaging device using a connector of the imagingdevice to support mobile operation of the imaging device in conjunctionwith the mobile user device, the imaging device comprising an infraredsensor assembly and a processing module; capturing thermal infraredimage data of a scene using the infrared sensor assembly; and providinginformation associated with the thermal infrared image data to themobile user device through the connector using the processing module.13. The method of claim 12, wherein the information is provided to themobile user device for display, storage, and/or processing by the mobileuser device.
 14. The method of claim 12, wherein the connector comprisesa connector plug.
 15. The method of claim 12, further comprising passingelectrical power via the connector to the mobile user device for use bythe mobile user device.
 16. The method of claim 12, wherein the imagingdevice further comprises a geo-spatial location sensor, the methodfurther comprising linking the thermal infrared image data to a locationusing the geo-spatial location sensor.
 17. The method of claim 12,further comprising: capturing non-thermal image data using a non-thermalcamera module; and combining the non-thermal image data and the thermalinfrared image data to generate combined image data.
 18. The method ofclaim 17, wherein the non-thermal camera module is in the imaging deviceor the mobile user device.
 19. The method of claim 12, wherein theimaging device further comprises a supplementary component, the methodfurther comprising: generating sensor data associated with at least aportion of the scene using the supplementary component; and providinginformation associated with the sensor data to the mobile user device.20. The method of claim 19, wherein the supplementary componentcomprises at least one of a moisture sensor configured to generatemoisture level data associated with the portion of the scene or anelectrical parameter sensor configured to generate electrical parameterdata associated with the portion of the scene.